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Wafer baking device and method

A baking device and baking method technology, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of uneven heating, uneven heating of wafers, uneven baking, etc., and achieve no increase in baking Baking time, solving uneven baking, and reducing defects

Inactive Publication Date: 2019-02-26
YANGTZE MEMORY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In either case, it will cause the wafer to be heated unevenly during the baking process
The effect of uneven heating will be more serious when heat-treating ultra-thin wafers
[0004] Therefore, there is an urgent need for an easy-to-operate, low-cost wafer baking device and method to solve the problem of uneven baking

Method used

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  • Wafer baking device and method
  • Wafer baking device and method
  • Wafer baking device and method

Examples

Experimental program
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Effect test

Embodiment

[0065] like Figure 4 In the steps shown, a silicon wafer W (for example, 300 mm (12 inches)) is baked according to the method of the present invention.

[0066] baking device such as image 3 As shown, the upper and lower baking parts are the same, and they are all made of ceramic materials and embedded with resistance wire baking plates distributed in concentric circles. Set the temperature of the baking tray to 250°C, and the first and second baking times are the same, both being 30s.

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PUM

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Abstract

The invention discloses a wafer baking device and method. The wafer baking device comprises: a baking chamber; a first baking part arranged at the lower part of the baking chamber; a second baking part arranged on the upper part of the baking chamber; a lifting unit configured to pass through the first baking part for lifting or lowering the height of the wafer laid flat on the lifting unit; a lifting unit driving device used for driving the lifting unit to vertically move. The device of the invention has a simple structure and is easy to obtain by simply reforming the prior wafer baking device. The wafer baked by the method of the invention is uniformly heated, and defects caused by uneven heating are greatly reduced.

Description

technical field [0001] The invention relates to a wafer baking device and method. Background technique [0002] In the current wafer preparation method, the wafer will be deformed due to the stress in the manufacturing process, resulting in warping of the wafer. [0003] According to the requirements of the process, it is usually necessary to bake the wafer. However, even a wafer that looks very flat to the naked eye will inevitably have a certain degree of deformation and warpage. Both. No matter which of the above situations will cause the wafer to be heated unevenly during the baking process. The influence of this non-uniform heating will be more serious when the ultra-thin wafer is heat-treated. [0004] Therefore, there is an urgent need for an easy-to-operate, low-cost wafer baking device and method to solve the problem of uneven baking. Contents of the invention [0005] The object of the present invention is to provide a wafer baking device and a baking method...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/687
CPCH01L21/67098H01L21/68764
Inventor 颜柏寒冯耀斌张鹏真
Owner YANGTZE MEMORY TECH CO LTD