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Chip automatic pressing and covering device

A chip and equipment technology, applied in the field of automatic chip capping equipment, can solve the problems of high defective product rate, low efficiency and inaccurate pressing position.

Active Publication Date: 2019-02-26
SHENZHEN GRAND INNOSYS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the semiconductor industry, most of the capping work of chips is done manually, which is not only low in efficiency and high in cost, but also due to inaccurate pressing positions, glue leakage and other phenomena often occur, resulting in a high rate of defective products

Method used

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  • Chip automatic pressing and covering device
  • Chip automatic pressing and covering device
  • Chip automatic pressing and covering device

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Embodiment Construction

[0075] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0076] Such as Figure 1 to Figure 3As shown, the embodiment of the present invention firstly provides a bonding fixture, including a top cover fixture 1 and a chip fixture 2 . The front of the upper cover jig 1 is provided with a shallow slot 11 for placing the chip upper cover 3, and the front of the chip jig 2 is provided with an assembly position 21 for placing the chip, and the periphery of the assembly position 21 is provided with a positioning position on th...

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Abstract

The invention provides a chip automatic pressing and covering device. Compared with the prior art, the chip automatic pressing and covering device can complete all links of the chip covering and chippressing in a continuous, rapid and independent manner, and workers only need to carry out jig changing and other simple operation, so as to greatly improve efficiency of chip pressing and covering operation, reduce workload of the workers, reduce labor cost, and prevent problems of inaccurate pressing position and often glue leakage caused by manual pressing and covering, and improve pass percentof finished products.

Description

technical field [0001] The invention relates to the technical field of chip assembly, in particular to an automatic chip capping device. Background technique [0002] With the continuous development of the country's comprehensive national strength, China's industry has made great progress, from the previous labor-intensive industries to high-tech industries, and the automation industry has a strong foundation. At the same time, people's living standards have also made a qualitative leap along with the prosperity of the country, but this has been accompanied by the continuous growth of people's material needs, which has directly led to the continuous increase of domestic factory labor costs. On this basis, in order to save costs and improve corporate competitiveness, many factories are trying to reduce labor costs and begin to import a large number of automation equipment. [0003] In the semiconductor industry, the capping work of chips is mostly done manually, which is not...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67121
Inventor 林宜龙刘飞王能翔吴松袁启湖吕玲利林清岚张萍萍占勇吴海裕
Owner SHENZHEN GRAND INNOSYS CORP