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Encapsulation device

A potting and mounting frame technology, which is used in identification devices, devices for applying liquid to surfaces, coatings, etc., can solve problems such as affecting the disassembly of the two, and the easy bonding between the potted electronic components and the potting body.

Pending Publication Date: 2019-03-08
LEYARD TV TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The main purpose of the present invention is to provide a potting device to solve the problem in the prior art that bonding between the potted electronic components and the potting body is easy to occur, which affects the disassembly of the two

Method used

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Embodiment Construction

[0024] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and examples.

[0025] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by those of ordinary skill in the art to which this application belongs.

[0026] In the present invention, in the absence of a contrary statement, the used orientation words such as "up and down" usually refer to the direction shown in the drawings, or refer to the vertical, vertical or gravity direction Similarly, for the convenience of understanding and description, "left and right" usually refer to the left and right shown in the drawings; The words are not used to limit the invention.

[0027] In order to solve the problem in...

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Abstract

The invention provides an encapsulation device. The encapsulation device comprises a main encapsulation body and a transition connecting structure; the main encapsulation body comprises a mounting frame, connecting parts and fixing pieces; the fixing pieces are connected to the inner walls of the mounting frame through the connecting parts; the upper end surfaces of the fixing pieces bulge out ofthe upper end surfaces of the connecting parts; the transition connecting structure is detachably connected with an encapsulated electronic element and is located below the encapsulated electronic element; the encapsulated electronic element is connected with the fixing pieces through the transition connecting structure; when the main encapsulation body and the encapsulated electronic element areassembled in place, the orthographic projection of the transition connecting structure on a support of the encapsulated electronic element is located inside the support, and the preset distances h arereserved between the lower end surface of the transition connecting structure and the upper end surfaces of the connecting parts. By the aid of the encapsulation device, the problem that dismountingof the encapsulated electronic element and the main encapsulation body is affected due to the fact that the encapsulated electronic element and the main encapsulation body are bonded easily in the prior art is solved effectively.

Description

technical field [0001] The invention relates to the technical field of LED potting, in particular to a potting device. Background technique [0002] At present, LED (Light Emitting Diode), as a light source, has the advantages of high brightness, small size, long life, etc., and is widely used in display devices. LED display is a commonly used display device. However, the LED displays on the market are relatively fragile, have poor impact resistance, will be damaged when subjected to a large external impact, and have poor waterproof and dustproof effects. In order to improve the impact resistance of the LED display, resin materials are usually potted on the surface of the LED display. [0003] However, during the potting process, the potted electronic components and the potting body are often bonded together by resin glue, which makes the two difficult to disassemble, which affects the potting quality and processing efficiency. Contents of the invention [0004] The mai...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C5/00B05C13/02G09F9/33
CPCG09F9/33B05C5/00B05C13/02
Inventor 孙雪超段冰蕾苟建周
Owner LEYARD TV TECH CO LTD
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