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Cutting lobes device and cutting lobes method

A splitting and cutting line technology, applied in the field of splitting devices, can solve problems such as poor appearance, achieve the effect of reducing the manpower demand of the factory and the risk of human error, reducing the risk of poor appearance and reliability, and precise cutting

Active Publication Date: 2021-01-15
WUHAN CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a cutting splitting device and cutting splitting method to alleviate the technical problem of poor appearance caused by edge extrusion and collision of existing panels during the splitting process

Method used

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  • Cutting lobes device and cutting lobes method
  • Cutting lobes device and cutting lobes method
  • Cutting lobes device and cutting lobes method

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Embodiment Construction

[0031] The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the invention may be practiced. The directional terms mentioned in the present invention, such as [top], [bottom], [front], [back], [left], [right], [inside], [outside], [side], etc., are only for reference The orientation of the attached schema. Therefore, the directional terms used are used to illustrate and understand the present invention, but not to limit the present invention. In the figures, structurally similar elements are denoted by the same reference numerals.

[0032] The present invention aims at that the existing slitting method may cause extrusion on the edge of the panel, resulting in poor appearance or even fragmentation, and this embodiment can alleviate this defect.

[0033] An embodiment of the present invention provides a cutting and splitting device, which includes a cutting assembly and a carrying platform. The cu...

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Abstract

A panel cutting and splitting apparatus and method. The panel cutting and splitting apparatus comprises a cutting assembly and a support platform. The support platform comprises a plurality of movable support units. Each support unit can support a cut sub-panel to move horizontally in a direction perpendicular to a cut line such that the two adjacent sub-panels are split along the cut line. The panels are spaced apart and split in a horizontal direction to prevent the edges thereof from getting struck or colliding during a panel splitting process, thereby reducing aesthetic damage.

Description

technical field [0001] The invention relates to the technical field of liquid crystal panel production, in particular to a cutting and splitting device and a cutting and splitting method. Background technique [0002] In the prior art, when manufacturing a display device, it is necessary to cut a large-format display substrate or display panel. After the cutting is completed, the cut panel needs to be split, and the split small display substrate or display panel is used to make a display device. . [0003] In the cutting and splitting process of the existing display equipment, after the cutting is completed, the personnel splits or the machine directly splits through the mechanical arm, such as figure 1 As shown, the cutting assembly 11 forms a cutting gap 13 of a certain depth on the panel 10 by cutting, but at this time the panel 10 itself has not cracked, so after the cutting is completed, it is necessary to apply a force in the direction 14 to the panel 10 after cutting...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03B33/02
CPCC03B33/02
Inventor 郑俊丰龙冲
Owner WUHAN CHINA STAR OPTOELECTRONICS TECH CO LTD