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Method for optimizing scribing quality

A dicing and dicing machine technology, which is applied in the manufacture of electrical components, semiconductor/solid-state devices, circuits, etc., can solve the problems of chipping and chipping of devices, reduce chipping, improve the quality of dicing, and improve the reliability of process operation sexual effect

Inactive Publication Date: 2019-03-08
11TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The invention provides a process improvement method to solve the problem in the prior art that scribing is easy to cause device edge chipping

Method used

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  • Method for optimizing scribing quality
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  • Method for optimizing scribing quality

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preparation example Construction

[0041] In the preparation process of some device work, after the device is separated into independent devices, the back thinning process is required to thin the device to a certain thickness before it can be put into use. In this case, the final remaining device sidewall is dry etching or wet etching corroded ( Figure 5 As shown in c), the edge of the device is smooth and free of burrs, which eliminates the hidden dangers of other problems caused by burrs, chipping and other topography in the long-term operation of the device, and improves the reliability of the device.

[0042] In addition to the above two advantages, since the side of the front surface is obtained by dry etching or wet etching technology, it is smooth and burr-free, which improves the initial yield of the device (in the original scribing process, some devices were chipped due to chipping around the surface. The chipping problem is serious and is screened out, which reduces the yield rate. This technical met...

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PUM

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Abstract

The invention discloses a method for optimizing the scribing quality. According to the method, before scribing, grooves with a certain depth and a certain width are dug at positions of edge-scribing lines, then scribing is performed, scribing is performed in the pre-dug grooves so that the scribing quality of soft brittle materials can be improved, the probability of edge crack and burr of the front surface of the device is reduced, the influence of the stress on the performance of a practical operation area of the device in a scribing process is reduced, and the operation reliability of the subsequent process is improved.

Description

technical field [0001] The invention relates to the technical field of device technology, in particular to a method for optimizing scribing quality. Background technique [0002] With the continuous advancement of semiconductor material preparation technology, the crystal size of materials continues to expand (taking indium antimonide material as an example, the wafer size has grown from 2 inches to 3 inches and 6 inches), and the growth of large-area wafers has become batch device chips. The preparation and the overall reduction of device cost have laid the foundation. [0003] The manufacturing process of semiconductor devices is briefly described as follows: In the production process of semiconductor devices, multiple devices can be prepared on the same wafer at the same time through the repeated array operation of photolithography process. After diffusion, passivation, metal deposition After the process flow, multiple devices with independent performance are formed on t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/78H01L21/67
CPCH01L21/67092H01L21/78
Inventor 李海燕邱国臣
Owner 11TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP