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Display device, manufacturing method thereof, and display device

A display device, one-to-one correspondence technology, applied in semiconductor/solid-state device manufacturing, identification devices, static indicators, etc., can solve problems such as large COF impedance and inability to test

Active Publication Date: 2022-01-11
HEFEI XINSHENG OPTOELECTRONICS TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention provides a display device and its preparation method and display device, which are used to solve the problems in the prior art that the prepared COF has a relatively large impedance and cannot use AT PAD to provide signals for AT-related testing.

Method used

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  • Display device, manufacturing method thereof, and display device
  • Display device, manufacturing method thereof, and display device
  • Display device, manufacturing method thereof, and display device

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Embodiment Construction

[0045] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments . Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0046] Such as Figures 1A-1B As shown, an embodiment of the present invention provides a display device, including:

[0047] A base substrate 1, the base substrate 1 has a plurality of chip-on-film 2 regions corresponding to the chip-on-film 2 one-to-one;

[0048] Data line groups 3 formed on one side of the base substrate 1 and corresponding to the area of ​​the COF 2 one by one, each of the data line groups 3 includes a plurality of data...

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Abstract

The invention discloses a display device, a preparation method thereof and a display device, which are used to solve the problem in the prior art that the prepared COF has a relatively large impedance and cannot use an AT PAD to provide signals for AT-related testing. In the embodiment of the present invention, the data line groups corresponding to the chip-on-chip regions one-to-one are directly electrically connected to the short-circuit bar through the via hole, and there is a short-circuit bar electrically connected to the array detection contact point, and at the same time, there is a transparent one-to-one corresponding to the island metal The conductive electrode ITO is electrically connected to the island metal and the shorting bars on both sides of the island metal through the second via hole. Compared with the prior art, in the embodiment of the present invention, each data line is directly electrically connected to the short-circuit bar, and at the same time, the chip-on-film is connected through ITO and island metal, thus reducing the impedance in the data signal transmission circuit, At the same time, there is a short-circuit bar electrically connected to the array detection contact point, so that the chip-on-film array detection can be performed directly through the array detection contact point.

Description

technical field [0001] The invention relates to the technical field of display devices, in particular to a display device, a manufacturing method thereof, and a display device. Background technique [0002] COF (Chip On Flex, or, Chip On Film, chip on film) is to use the soft accessory circuit board as the package chip carrier to bond the flexible substrate circuit, or simply refer to the soft add-on circuit board of the unpackaged chip. To use the COF film, the COF film needs to be cut out from the COF film carrier tape first. In the prior art, the chip-on film carrier tape is generally cut by gold die cutting. [0003] In the prior art, a shorting bar (short-circuit bar) is used to shorten (connect) the data R (R data line) or G (G data line) in a single COF when making a COF. Use another shorting bar (short-circuit bar) to connect all R data lines or G data lines in finalITO (suspended indium tin oxide). At this time, each data line (data line) is connected to the short...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G09G3/30G09F9/00H01L21/77
CPCG09F9/00G09G3/30H01L21/77
Inventor 汪军王海涛李广耀王庆贺王东方袁志东闫梁臣钱国平
Owner HEFEI XINSHENG OPTOELECTRONICS TECH CO LTD