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A LED lamp processing system

A processing system and LED lamp technology, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems such as the inability to pick up chips, and achieve good buffer protection effects, easy to pick up chips, and easy to use by the die-bonding mechanism.

Active Publication Date: 2021-01-12
惠州市文晨灯箱科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, when the chips leave the factory, they are all attached to the chip film one by one very close to each other. Therefore, the die bonder cannot pick up the chips on the chip film for fixing.

Method used

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  • A LED lamp processing system
  • A LED lamp processing system
  • A LED lamp processing system

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Embodiment Construction

[0025] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention.

[0026] Such as Figure 1-9 As shown, an LED lamp processing system, the processing of LED lamps is divided into multiple processes, and this processing equipment is mainly aimed at the steps of crystal expansion and solid crystal. Specifically, crystal expansion is an auxiliary process before die bonding. When the chips leave the factory, they are attached to the chip film one by one very close to each other, so there is no way to use the crystal bonding mechanism. The chip film is stretched, so that the distance between the chips is separated, which is convenient for the use of the die-bonding mechanism. Specifically, the crystal expansion mechanism includes a base 1, a fra...

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Abstract

The invention discloses an LED lamp processing system, which includes a wafer expanding mechanism used for chip film stretching, a die bonding mechanism used for fixing chips and a transporting mechanism used for transporting chip films to the die bonding mechanism. The wafer expanding mechanism includes a base used for fixing and supporting, a placement platform used for placing chip films, a stretching component used for wafer expanding and a cutting member used for cutting redundant chip films. The stretching component includes multiple movable clamp arms arranged on the outer side of the placement platform. The stretching component is arranged around a chip film to stretch the chip film uniformly, so that the spacing between the chips on the chip film increases uniformly, and the use of the chip film by the die bonding mechanism is facilitated.

Description

technical field [0001] The invention belongs to the technical field of LED lamps, in particular to an LED lamp processing system. Background technique [0002] The LED lamp is an electroluminescent semiconductor material chip, which is cured on the bracket with silver glue or white glue, and then connected to the chip and the circuit board with silver or gold wires, and sealed with epoxy resin around it to protect the inner core wire. Function, the shell is finally installed, so the shock resistance of the LED lamp is good. [0003] However, when the chips leave the factory, they are all attached to the chip film one by one very close to each other. Therefore, the die bonder cannot pick up the chips on the chip film for fixing. Contents of the invention [0004] In order to overcome the deficiencies of the prior art, the present invention provides an LED lamp processing system capable of increasing the distance between chips. [0005] In order to achieve the above object...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683
CPCH01L21/6835H01L2221/68318H01L2221/68336H01L2221/68381
Inventor 李颖
Owner 惠州市文晨灯箱科技有限公司