Power device heat radiating apparatus
A technology for power devices and heat sinks, which is applied in the direction of circuit heat devices and printed circuit components, can solve the problems of low heat dissipation capacity of a single heat sink, and the inability to use universal heat sinks for power devices, so as to achieve good versatility, improve heat dissipation, The effect of increasing the cooling area
Inactive Publication Date: 2019-03-26
ZHENGZHOU NORMAL UNIV
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Problems solved by technology
[0003] The purpose of the present invention is to provide a power device cooling device to solve the problem that the traditional power device cooling device cannot be used universally and the heat dissipation capacity of a single cooling device is low
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[0021] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.
[0022] The purpose of the present invention is to provide a power device heat dissipation device to solve the problem that the traditional power device heat dissipation device cannot be universal and the heat dissipation capacity of a single heat dissipation device is low.
[0023] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention will be...
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The invention discloses a power device heat radiating apparatus. The power device heat radiating apparatus includes a first heat radiating module and a second heat radiating module. The first heat radiating module and the second heat radiating module are of the same structure. Because both the two heat radiating modules have bolt connecting holes in the installation surfaces thereof, the two endsof a power device can be respectively fixed to the first heat radiating module and the second heat radiating module. Therefore, the power device heat radiating apparatus provided by the invention is applicable to various specifications of power devices and is of good versatility. Each heat radiating module is composed of upper and lower heat radiating fin groups, and the first heat radiating module and the second heat radiating module have four groups of heat radiating fins which are arranged closely. The heat radiating area of a single power device heat radiating apparatus is increased without increasing the volume of the heat radiating apparatus, and the heat radiating capacity is improved.
Description
Technical field [0001] The present invention relates to the technical field of heat dissipation of power devices, in particular to a heat dissipation device for power devices. Background technique [0002] The circuit board is equipped with power devices such as diodes, triodes, MOS tubes, thyristors, rectifier bridges, IGBTs, etc. The power devices will generate heat during operation. If the heat cannot be dissipated for a long time, the power devices will be burned and the performance of the equipment will be affected. influences. In order to dissipate heat from power devices, a heat sink is often installed on the circuit board. However, the radiator mounting slot size setting in the prior art is unreasonable, and is usually only suitable for installing power devices of the same or similar specifications, and cannot be universal. And the heat dissipation of the power devices on the circuit board is mostly realized by the heat sink. If the area of the heat sink is too small,...
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IPC IPC(8): H05K1/02
CPCH05K1/0209
Inventor 周金成张明慧黄丹丹赵高武冰洁陈卫光李成刚
Owner ZHENGZHOU NORMAL UNIV