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A kind of outer cylindrical polishing equipment of high-purity copper rotating target

A technology of rotating target and high-purity copper, which is applied in the direction of grinding/polishing equipment, machine tools designed for grinding the rotating surface of workpieces, metal processing equipment, etc., and can solve problems such as inconvenient polishing

Active Publication Date: 2020-10-20
ZHONGKE CRYSTAL MATERIALS (DONGGUAN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a high-purity copper rotary target outer circle polishing equipment, which can solve the problem that some polishing equipment is inconvenient to polish the steps of the rotary target port

Method used

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  • A kind of outer cylindrical polishing equipment of high-purity copper rotating target
  • A kind of outer cylindrical polishing equipment of high-purity copper rotating target
  • A kind of outer cylindrical polishing equipment of high-purity copper rotating target

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Embodiment Construction

[0029] A specific embodiment of the present invention will be described in detail below in conjunction with the accompanying drawings, but it should be understood that the protection scope of the present invention is not limited by the specific embodiment.

[0030] Such as Figure 1 to Figure 10 As shown, a high-purity copper rotary target cylindrical polishing equipment provided by the embodiment of the present invention includes a frame 1, two clamping mechanisms and a polishing mechanism for clamping the rotary target 2, and the frame 1 is composed of The first support base 101 and the second support base 102 are composed, one of the clamping mechanisms is slidably arranged on the first support base 101, and the other clamping mechanism is fixedly installed on the first support base 101, the polishing mechanism is slidably arranged on the second support base 102;

[0031] The two clamping mechanisms all include a first base 11, a rotating cylinder 12 rotatably arranged on ...

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Abstract

The invention discloses an outer circle polishing device of a high-purity copper rotary target, and belongs to the field of rotary target machining equipment. The outer circle polishing device of thehigh-purity copper rotary target solves the problem that polishing equipment is inconvenient to polish the port step of a rotary target. The outer circle polishing device comprises a machine frame, aclamping mechanism and a polishing mechanism, the machine frame is composed of a first supporting seat and a second supporting seat, the clamping mechanism is arranged on the first supporting seat ina sliding mode, the polishing mechanism is slidably arranged on the second supporting seat, the clamping mechanism comprises a first base, a rotary cylinder and a threaded block ejector rod, and the polishing mechanism comprises two groups of polishing groups, a second base, a swing arm and a lead screw. The clamping mechanism can be used for fixing rotary targets with different lengths, the polishing mechanism can automatically polish the whole rotary target, when the polishing mechanism moves to the port of the rotary target, the polishing mechanism can polish the step of the rotary target port through adjustment of a lifting wheel, so that the participation of workers can be reduced, the labor intensity of the workers can be reduced, and the working efficiency can be improved.

Description

technical field [0001] The invention relates to the field of rotating target processing equipment, in particular to an outer circle polishing equipment for a high-purity copper rotating target. Background technique [0002] The target surface roughness of the rotating target has a great influence on the film forming speed and uniformity of magnetron sputtering. At present, the target surface of the rotating target is generally polished manually by workers, which is labor-intensive and uneven in polishing. The problem of low polishing precision and low polishing efficiency, especially the lack of precision polishing equipment for long-length rotating targets, so it is necessary to improve; [0003] The patent with the application number 201820425795.4 discloses a high-purity copper rotary target cylindrical polishing equipment, including a frame, a clamping device and a polishing device. The clamping device and the polishing device are respectively installed on the frame. The...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B21/02B24B21/18B24B41/06
CPCB24B5/00B24B41/06
Inventor 付莹于占东杨彬郭继宁邢星于震
Owner ZHONGKE CRYSTAL MATERIALS (DONGGUAN) CO LTD