The invention belongs to the field of
integrated circuit design, particularly relates to a method capable of carrying out
self test on a
chip without depending on an external device in the condition of live working and performing
self repair according to a test result. The
self test of the method can be applied to all structures and parts in the
chip; and the
self repair of the method can be applied to all structures and parts with
backup units. The self-test and self-repair course based on the method comprises two stages: a first stage is test and repair stage, wherein the
self test is carried out firstly, and a failure unit is replaced by a
backup unit according to a test result; and a second stage is the retest stage, wherein if no error is tested, the on-
wafer self-test and self-repair is finished, and otherwise an unrepairable
signal is produced for external detection. The invention realizes on-
wafer self repair with lower cost and replaces a failure part with the
backup unit, thereby improving the
yield rate and the reliability of the
chip, and effectively reducing the testing time and the testing cost.