Exposure apparatus, exposure method, and device manufacturing method

A technology of exposure device and light source, applied in the field of lithography system and process, can solve the problem of lithography equipment being unable to switch modes and the like
CN109634059BActive Publication Date: 2020-10-16SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
Publication Date
2020-10-16

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Abstract

The invention discloses an exposure device which comprises an optical lens module and a lighting module, wherein the optical lens module is provided with an aperture diaphragm, and the aperture diaphragm is used for adjusting a numerical aperture of the optical lens module to enable the optical lens module to have a first numerical aperture and a second numerical aperture, wherein the first numerical aperture is greater than the second numerical aperture; and the lighting module is used for providing a first lighting source and a second lighting source, a center wavelength of the first lighting source is smaller than a center wavelength of the second lighting source, and a spectral line width of the second lighting source is greater than a spectral line width of the first lighting source.According to the invention, switching between a high-resolution mode and a high-yield mode is implemented by selection and switching of the numerical apertures and the lighting sources. Further, by adopting an exposure method of the exposure device and a manufacturing method of an element, which are provided by the invention, switching between the high-resolution mode and the high-yield mode canbe implemented.
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Description

technical field

[0001] The invention relates to a photolithography system and technology in the field of semiconductor preparation, in particular to an optical lens module. Background technique

[0002] With the development of semiconductor technology, the size of semiconductor devices continues to shrink. Correspondingly, various preparation processes in the field of semiconductor preparation also have higher requirements for process nodes, and higher-precision process equipment is required to meet the requirements of the process. demanding.

[0003] At present, in the back-end packaging field of semiconductor processing and manufacturing, the requirements for the resolution of photolithography processes are getting higher and higher, from the previous common 3-10 μm to 1-3 μm, and there are even process requirements below 1 μm. Although high resolution has become the pursuit in the production process, however, in the actual production process, production efficiency is als...

Claims

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