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System and method for 3D surface measurement

A technology of surface measurement and surface normal, applied in the direction of measurement devices, stereo systems, components of TV systems, etc., can solve problems such as inability to measure surface reflection characteristics, insufficient reflection field sampling, affecting the estimation of surface normals, etc.

Active Publication Date: 2021-10-29
MURA INC
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AI Technical Summary

Problems solved by technology

Micron-scale depth resolution and accuracy are difficult to achieve because cameras cannot capture surface images at close range
These conventional techniques use a limited number of extended light sources, and due to physical dimension constraints, usually arrange a large number of angular sampling steps
This can lead to undersampling of the reflection field, affecting the estimation of surface normals for relatively smoother specular surfaces
Also, often some extended lights are placed at oblique angles, which can introduce severe shadowing effects
Most conventional methods cannot measure reflective properties of surfaces

Method used

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  • System and method for 3D surface measurement
  • System and method for 3D surface measurement
  • System and method for 3D surface measurement

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Embodiment Construction

[0098] The following description is directed to certain implementations in order to describe various aspects of the disclosure. However, those skilled in the art will readily recognize that the teachings herein can be applied in a variety of different ways. Accordingly, the present teachings are not intended to be limited to only the embodiments depicted in the figures, but have broad applicability, as will be apparent to those skilled in the art.

[0099] Embodiments relate to methods and systems for 3D surface measurement (3DSM methods and systems), including measurements of microgeometric and surface properties such as reflection properties, emissivity properties, translucency properties, and the like. The 3DSM system implements methods that can be used to simultaneously obtain surface geometry and properties. In various embodiments, the 3DSM system includes an engineered illumination system that generates and manipulates the incident direction of engineered illumination t...

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Abstract

Certain embodiments relate to 3D surface measurement systems and methods configured to direct engineering illumination rays in one or more light beams to N illumination directions incident on a sample surface. The system and method can measure surface normal maps, depth maps, and surface property maps using intensity images captured while engineered illumination is directed to the sample surface.

Description

[0001] Cross References to Related Applications [0002] This application claims U.S. Application No. 15 / 655,656, filed July 20, 2017, entitled "Systems and Methods for 3D Surface Measurements," and U.S. Provisional Patent Application No. 62 / 364,320, filed July 20, 2016, entitled "Systems and Methods for 3D Surface Measurements." Methods for 3D Surface Microgeometry and ReflectanceProperties Measurement," and the priority of U.S. Provisional Patent Application No. 62,511,964, filed May 27, 2017, entitled "Systems and Methods for 3D Surface Microgeometry and ReflectanceProperties Measurement," each of which is incorporated by reference in its entirety are incorporated herein for all purposes. technical field [0003] Certain embodiments described herein relate generally to system measurements, and more specifically, to 3D surface measurement methods and systems (3DSM methods and systems) for measuring surface microgeometry and / or surface properties, useful in, for example, defe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01B11/25G06T1/00G06T7/60H04N5/225
CPCG01B11/25G01B11/303H04N13/271H04N13/296
Inventor 孟令飞江俊
Owner MURA INC
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