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Ceramic bimorph

A technology of ceramic chips and double chips, applied in the field of double chips, can solve the problems of short service life, poor toughness, low structural strength, etc., and achieve the effects of long service life, enhanced toughness and high humanity

Inactive Publication Date: 2019-04-30
张元龙
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the existing bimorph has low structural strength, poor toughness and short service life

Method used

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  • Ceramic bimorph

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Embodiment Construction

[0009] The present invention will be further described below in conjunction with accompanying drawing.

[0010] see figure 1 , the ceramic double chip of the present invention includes a substrate, and ceramic sheets are respectively arranged on both sides of the substrate, a first conductive layer is provided between each ceramic sheet and the substrate, and capillary strengthening structures are respectively provided on both sides of each ceramic sheet A carbon paste layer is provided on the side of each ceramic sheet away from the first conductive layer, a second conductive layer is provided between the ceramic sheet and the carbon paste layer, and the capillary strengthening structure includes several ceramic sheets arranged on both sides of each ceramic sheet. The capillary groove, the first conductive layer and the second conductive layer are both silver paste conductive layers.

[0011] The invention has high structural strength, high human nature and long service life...

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Abstract

The invention discloses a ceramic bimorph, which comprises a substrate, wherein both surfaces of the substrate are respectively provided with a ceramic sheet, first electric-conduction layers are arranged between each ceramic sheet and the substrate, both surfaces of each ceramic sheet are respectively provided with a capillary reinforcing structure, one surface, away from the first electric-conduction layer, of the ceramic sheet is provided with a carbon paste layer, and a second electric-conduction layer is arranged between the ceramic sheet and the carbon paste layer. According to the present invention, the ceramic bimorph has advantages of high structural strength, high humanity and long service life, is provided with the capillary reinforcing structures so as to further enhance the toughness of the ceramic sheet, and further has characteristics of prolonged service life, strong practicability and reduced use cost.

Description

technical field [0001] The invention relates to a bimorph, in particular to a ceramic bimorph. Background technique [0002] Bimorph structures include substrate-bonded ceramic structures. At present, the existing bimorphs have low structural strength, poor toughness and short service life. Contents of the invention [0003] The object of the present invention is to provide a ceramic double chip with high structural strength, high humanity and long service life. [0004] In order to achieve the above object, the technical solution adopted by the present invention is as follows: the ceramic bimorph of the present invention includes a substrate, and ceramic sheets are respectively arranged on both sides of the substrate, and a first conductive layer is arranged between each ceramic sheet and the substrate, Capillary strengthening structures are respectively provided on both sides of each ceramic sheet, a carbon paste layer is provided on the side of each ceramic sheet away...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B9/00B32B9/04B32B3/08
CPCB32B9/005B32B3/08B32B9/007B32B9/04B32B2307/558
Inventor 张元龙
Owner 张元龙