Anisotropic conductive structure, manufacturing method thereof, and display device
A technology of anisotropic conduction and anisotropic conductive film, which is applied to identification devices, conductive adhesives, conductive layers on insulating carriers, etc., and can solve the problem of separation of substrates or chips from anisotropic conductive adhesives, device failure, etc. question
Active Publication Date: 2021-11-02
BOE TECH GRP CO LTD +1
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Problems solved by technology
[0003] During the application process, the heat generated by the chip when the device is working will generate heat accumulation in the bonding area, and the heat accumulation will become more obvious as the power consumption of the chip increases. The anisotropic conductive adhesive will expand or shrink, which will cause the substrate or chip to separate from the anisotropic conductive adhesive at the interface, resulting in device failure
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[0032] In the related art, the structure of the anisotropic conductive adhesive is as follows figure 1 and figure 2 As shown, it includes insulating material 1 and conductive particles 2. When binding with the panel Panel and chip IC, the conductive particles 2 appear to conduct in the vertical direction under the force of the panel Panel and chip IC, and in the horizontal direction insulation. However, during the working process of the panel, the heat generated by the panel and the chip IC will gather at the bonding place, such as image 3 As shown, when the anisotropic conductive adhesive between the chip IC and the panel Panel will expand or shrink during the high temperature, low temperature or high and low temperature cycle, the panel Panel and / or the chip IC and the anisotropic conductive adhesive will Separation occurs at the interface, and the electrical connection between the panel Panel and the chip IC cannot be maintained.
[0033] Therefore, aiming at the above...
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The invention discloses an anisotropic conductive structure, a manufacturing method thereof, and a display device. The anisotropic conductive structure includes: an anisotropic conductive film, and the anisotropic conductive structure includes: a conductive region and an insulating region; On either side of the anisotropic conductive film in the region, and the first film layer whose thermal conductivity is greater than that of the insulating matrix material; and / or, at least on either side of the anisotropic conductive film in the insulating region, and has a thermal expansion coefficient smaller than that of the insulating The coefficient of thermal expansion of the matrix material for the second film layer. By arranging the first film layer with thermal conductivity greater than the thermal conductivity of the insulating matrix material in the conductive area, heat accumulation during the operation of the device can be alleviated; by setting the second film layer with a thermal expansion coefficient smaller than the thermal expansion coefficient of the insulating matrix material in the insulating area , can reduce the volume change of the anisotropic conductive structure when the temperature changes, thereby alleviating the problem of separation between the anisotropic conductive structure and the adjacent interface.
Description
technical field [0001] The invention relates to the field of display technology, in particular to an anisotropic conductive structure, a manufacturing method thereof, and a display device. Background technique [0002] In related technologies, the anisotropic conductive adhesive used to bind the substrate and the chip in the device includes insulating materials and conductive particles, and anisotropic conduction is realized through conductive balls and insulating materials, that is, vertical conduction and lateral insulation. [0003] During the application process, the heat generated by the chip when the device is working will generate heat accumulation in the bonding area, and the heat accumulation will become more obvious as the power consumption of the chip increases. The anisotropic conductive adhesive will expand or shrink, which will cause the substrate or chip to separate from the anisotropic conductive adhesive at the interface, resulting in device failure. [000...
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IPC IPC(8): C09J7/20C09J7/30C09J9/02C09J163/00G09F9/00H01B1/24H01B5/14
Inventor 李伟袁世兵付超张娜李成毅王静
Owner BOE TECH GRP CO LTD