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LED display module and manufacturing method thereof

A technology of display module and production method, applied in static indicators, instruments, electrical components, etc., to ensure the effect of color brightness

Active Publication Date: 2019-05-10
UNILUMIN GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The main purpose of the present invention is to propose an LED display module and its manufacturing method, which aims to solve the problem that the traditional LED display module manufacturing method cannot simultaneously solve the problem of integrated packaging contrast and ensure uniform color and brightness of the display module. , Durable, reliable, and low-cost technical issues

Method used

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  • LED display module and manufacturing method thereof
  • LED display module and manufacturing method thereof
  • LED display module and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Such as figure 1 and figure 2 As shown, Embodiment 1 of the present invention provides an LED display module 100. The LED display module 100 includes an LED lamp board 110 and an encapsulation adhesive layer 120, wherein the LED lamp board 110 includes a PCB substrate 111 and edges along the PCB substrate 111. Several pixel chip units 112 are evenly distributed on the upper surface. The encapsulation adhesive layer 120 is laid along the upper surface of the PCB substrate 111 to encapsulate a plurality of pixel chip units 1112 . A plurality of optical windows 121 are opened on the encapsulation adhesive layer 120, and each optical window 121 is disposed directly above the pixel chip unit 112.

[0025] In this example, if figure 1 As shown, the plurality of optical windows 121 are arranged in one-to-one correspondence with the plurality of pixel chip units 112 , that is, each optical window 121 is arranged directly above the corresponding pixel chip unit 112 . Such a...

Embodiment 2

[0028] Such as image 3 As shown, Embodiment 2 of the present invention provides an LED display module 200. Compared with the LED display module 200 in Embodiment 1, the only difference is that the optical window 221 in this embodiment adopts the following opening method, Multiple pixel chip units 212 in each vertical column correspond to only one optical window 221, that is, originally figure 1 As shown, all optical windows 221 on the same column are connected together to form a image 3 One-piece optical window 221 is shown.

Embodiment 3

[0030] Such as image 3 As shown, Embodiment 3 of the present invention also proposes a manufacturing method of an LED display module, which is used to manufacture the LED display module 100 in Embodiment 1 above. The manufacturing method specifically includes the following steps:

[0031]Step S110: Assemble the lamp board driving module on the lower surface of the PCB substrate.

[0032] Specifically, as figure 2 As shown, the lower surface of the PCB substrate 111 is equipped with a lamp board driving module 113. During specific assembly, the lamp board driving module 113 can be assembled on the lower surface of the PCB substrate 111 by soldering, so that the lamp board driving module 113 and the PCB substrate Corresponding circuit leads on the lower surface of 111 are electrically connected.

[0033] Step S120: Assembling several pixel chip units on the upper surface of the PCB substrate, so that the several pixel chip units are evenly distributed along the upper surface...

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Abstract

The invention discloses an LED display module and a manufacturing method thereof and belongs to the technical field of LED display screens. The LED display module comprises an LED lamp panel and a packaging glue line. The LED lamp panel comprises a PCB base board and a plurality of pixel chip units uniformly distributed on the upper surface of the PCB base board; the packaging glue line is paved along the upper surface of the PCB base board to package the pixel chip units. A plurality of optical windows are formed in the packaging glue line and each optical window is located right above the pixel chip unit. According to the technical scheme, the pixel chip units are separated through the packaging glue line on one hand to make sure that the display module is uniform in color and bright andthe contrast of the display module is improved effectively. On the other hand, light emission of each pixel chip unit is ensured by forming the optical window, heating is reduced, and problems such as light infiltration and crosstalk among the pixels are solved.

Description

technical field [0001] The invention relates to the technical field of LED display screens, in particular to an LED display module and a manufacturing method thereof. Background technique [0002] With the development of indoor small-pitch LED display technology, in order to achieve smaller pixel pitch and meet higher reliability requirements, integrated packaging indoor small-pitch LED display products have emerged as the times require. These products use integrated packaging technology to integrate LED The chip is directly packaged on the LED driver board, eliminating the need for SMD packaging and reflow links. These integrated products are realized through the use of one-time overall packaging technology. They have the advantages of simple structure, easy realization of high density, high reliability and low packaging cost. technical features. Therefore, once the product comes out, it has received widespread attention from the industry. However, due to the dense wiring...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G09F9/33G09G3/32H01L25/075H01L33/54H01L33/58
Inventor 胡新喜孙天鹏张金刚张世诚
Owner UNILUMIN GRP