Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Electrostatic discharge protection structure and manufacture method thereof, and electronic device

A technology of electrostatic discharge protection and static electricity, which is applied in the electronic field and can solve problems such as ESD protection of soft and hard boards.

Pending Publication Date: 2019-05-14
HUAQIN TECH CO LTD
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides an electrostatic discharge protection structure, its manufacturing method, and electronic equipment, which are used to solve the technical problem in the prior art that the soft-hard combination board cannot be effectively protected against ESD

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electrostatic discharge protection structure and manufacture method thereof, and electronic device
  • Electrostatic discharge protection structure and manufacture method thereof, and electronic device
  • Electrostatic discharge protection structure and manufacture method thereof, and electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] Embodiments of the present invention provide an electrostatic discharge protection structure, a manufacturing method thereof, and electronic equipment, so as to solve the technical problem existing in the prior art that effective ESD protection cannot be performed on a rigid-flex board.

[0035] The technical solution in the embodiment of the present application is to solve the above-mentioned technical problems, and the general idea is as follows:

[0036] An electrostatic discharge protection structure is provided, which is applied to a rigid-flex board. The rigid-flex board includes a flexible board and a rigid board. At the junction of rigid boards, the width of the flexible plane conductor is not less than the width of the flexible board; wherein, the bonding surface where the flexible plane conductor is located is the side facing the object that generates electrostatic discharge, and is used to discharge the static electricity generated by the object that generates...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an electrostatic discharge protection structure and a manufacture method thereof, and an electronic device. In the prior art, effective ESD protection cannot be performed on ahard-soft combined board. The invention solves the above technical problem. The electrostatic discharge protection structure comprises a flexible plane conductor, wherein the flexible plane conductoris electrically connected with a grounding terminal and is attached to a joint of a flexible board and a hard board of the hard-soft combined board, the width of the flexible plane conductor is not less than the width of the flexible board, and an attached surface in which the flexible plane conductor is is a surface facing a generated electrostatic discharge object, and is used for discharging electrostatic generated by the generated electrostatic discharge object to the grounding terminal.

Description

technical field [0001] The invention relates to the field of electronics, in particular to an electrostatic discharge protection structure, a manufacturing method thereof, and electronic equipment. Background technique [0002] As rigid-flex boards are widely used in various electronic devices, it is increasingly difficult to protect rigid-flex boards from electrostatic discharge (ElectroStatic Discharge, ESD). [0003] ESD problems are easily caused by the exposed solder joints at the junction of the soft board part and the hard board part, as well as in the hard board part near the junction. When performing ESD protection on the soft and hard board, due to the limited space and small area of ​​the hard board, if the traditional hardware circuit ESD protection method is adopted, the through silicon channel (ThroughSilicon Vias) in the ESD protection circuit will be , TSV) tubes are difficult to place in it, which makes it difficult to provide ESD protection for rigid-flex ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05F3/02
Inventor 袁孝来
Owner HUAQIN TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com