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Sensing device and sensing method

A technology of a sensing device and a sensing method, which is applied in the direction of semiconductor/solid-state device testing/measurement, etc., can solve problems such as abnormal products, poor electrical properties of semiconductor chips, insufficient storage of flux 14, etc., so as to improve reliability and improve The effect of electrical yield

Active Publication Date: 2019-05-21
SILICONWARE PRECISION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, the existing semiconductor package 1 does not detect the storage amount of the soldering flux 14 when making the soldering flux 14. Therefore, the storage amount of the soldering flux 14 is often insufficient and no warning is issued. As a result, during the flip-chip packaging process, flux 14 is not formed on part of the solder bumps 13, resulting in poor electrical properties between the semiconductor chip 12 and the packaging substrate 11, leading to product abnormalities

Method used

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  • Sensing device and sensing method

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Embodiment Construction

[0035] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0036] It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. Limiting conditions, so there is no technical substantive meaning, any modification of structure, change of proportional relationship or adjustment of size, without affecting the effect and purpose of the present invention, should still fall within the scope of the present invention. The disclosed technical content must be within the scope covered. At the same time, terms such as "above" and "a" quoted in this ...

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Abstract

The invention relates to a sensing device and a sensing method. According to the sensing method, a detecting device which comprises a light emitting device and a receiver is used. The light emitting device emits light to a target object. Furthermore the receiver receives the reflecting state of the light for mastering the magnitude of the target object.

Description

technical field [0001] The present invention relates to a detection process, in particular to a sensing device and a sensing method for detecting whether the content of a target substance is sufficient. Background technique [0002] With the vigorous development of the electronic industry, electronic products tend to be thinner and smaller in form, and gradually enter the research and development direction of high performance, high function, and high speed in terms of function. In order to meet the high integration and miniaturization requirements of semiconductor devices, in addition to the traditional wire-bonded semiconductor packaging technology, flip-chip methods can also be used to increase wiring density. [0003] Such as figure 1 As shown, the existing flip-chip semiconductor package 1 is to combine a semiconductor chip 12 with a plurality of solder bumps 13 on a package substrate 11, and these solder bumps 13 have flux (flux) 14 on them to It is beneficial to refl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66
Inventor 王维宾林恩立庄孟宗陈金发郑坤一
Owner SILICONWARE PRECISION IND CO LTD