Material taking device for improving semiconductor welding reliability
A reclaiming device and reliability technology, which is applied in the field of reclaiming devices to improve the reliability of semiconductor welding, can solve problems such as increased working time, internal stress loss, chip corner defects, etc., to improve production efficiency, reduce damage risk, Reduce the effect of mutual stress
Pending Publication Date: 2022-05-13
广东瑞淞电子科技有限公司
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Problems solved by technology
[0003] At present, the rectifier bridge mostly uses GPP chips and leads to be directly loaded into the graphite welding mold for welding. After welding, the welded semi-finished product needs to be taken out from the graphite welding mold. Due to the uneven force, the chip and the lead cannot be taken out vertically from the graphite welding mold, and stress will be generated between each other, which will easily cause chip corner defects and internal stress loss, which will affect the electrical yield and reliability of the product chip, and at the same time, the efficiency of manual blanking is low , increased working hours
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Embodiment 1
[0026] This embodiment provides a specific implementation of a material retrieving device that improves the reliability of semiconductor welding, such as Figure 1-5 As shown, it includes a graphite welding plate 1 and a retrieving plate 2. The graphite welding plate 1 is arranged on the top of the retrieving plate 2. The graphite welding plate 1 is provided with a plurality of chip placement sink holes 11 and a plurality of lead placement grooves 12. The graphite welding plate 1 The four corners are provided with pad height columns 13, the center of the left and right sides of the graphite welding plate 1 is provided with guide holes 14, and the retrieving plate 2 is provided with some retrieving thimbles 21 and some lead wire avoidance holes 22. All of them are provided with space-avoiding holes 23 for heightening posts, and guide posts 24 are provided at the middle positions of the left and right sides of the material taking plate 2 .
[0027] Further, there is a pick-up an...
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The invention discloses a material taking device for improving semiconductor welding reliability, which comprises a graphite welding plate and a material taking plate, the graphite welding plate is arranged above the material taking plate, the graphite welding plate is provided with a plurality of chip placing counter bores and a plurality of lead placing grooves, and heightening columns are arranged at four corners of the graphite welding plate. Guide holes are formed in the centers of the left side and the right side of the graphite welding plate, a plurality of material taking ejector pins and a plurality of lead receding holes are formed in the material taking plate, heightening column receding holes are formed in the four corners of the material taking plate, and guide columns are arranged in the middles of the left side and the right side of the material taking plate. A plurality of welded products can be jacked up at a time, the production efficiency is improved, the mutual stress between the chip and the lead is reduced, the damage risk of the chip is reduced, the electrical yield of the product chip is improved, and the reliability of the product chip is improved.
Description
technical field [0001] The invention belongs to the technical field of semiconductor processing, in particular to a material picking device for improving the reliability of semiconductor welding. Background technique [0002] A semiconductor refers to a material whose conductivity is between that of a conductor and an insulator at room temperature. Semiconductors are widely used in radios, televisions, and temperature measurement. For example, a rectifier bridge is a device made of semiconductors. Control, ranging from materials between insulators to conductors, whether from the perspective of technology or economic development, the importance of semiconductors is huge, most of today's electronic products, such as computers, mobile phones or digital The core units in the recorder are closely related to semiconductors. Common semiconductor materials include silicon, germanium, gallium arsenide, etc., and silicon is the most influential one in commercial applications among var...
Claims
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IPC IPC(8): H01L21/67
CPCH01L21/67144
Inventor 徐海洪李泽文
Owner 广东瑞淞电子科技有限公司