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A method and a system for converting a wafer Map file into a pickup file

A file conversion and file technology, applied in the direction of program files, software maintenance/management, etc., can solve the problems of complex conversion program development and testing, etc.

Active Publication Date: 2019-05-28
BEIJING CHIPADVANCED
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the above-mentioned problem of complex development and testing of the conversion program or at least partially solve the above-mentioned problem, the present invention provides a method and system for converting a wafer Map file into a pick-up file

Method used

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  • A method and a system for converting a wafer Map file into a pickup file
  • A method and a system for converting a wafer Map file into a pickup file
  • A method and a system for converting a wafer Map file into a pickup file

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Embodiment Construction

[0036] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0037] In one embodiment of the present invention, a method for converting a wafer Map file into a pick-up file is provided, figure 1 It is a schematic diagram of the overall flow of the method for converting a wafer Map file into a pickup file provided by an embodiment of the present invention. The method includes: S1, obtaining target wafer information according to the Map file of the target wafer; S2, obtaining a preset pickup file. Each keyword in the chip file template is replaced by the corresponding target wafer information to generate a pick-up file.

[0038] Specifically, in S1, the wafer will produce a Map file after the mid-test, and the Map file is in binary f...

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Abstract

The invention provides a method and a system for converting a wafer Map file into a pickup file. The method comprises the steps of S1, obtaining target wafer information according to a Map file of a target wafer, and S2, obtaining keywords in a preset pickup file template, replacing the keywords with the corresponding target wafer information, and generating a pickup file. According to the invention, the film pickup file template is preset according to the requirements of each manufacturer; replacing the keywords in the template with the corresponding wafer information; according to the methodand the device, the wafer Map file is converted into the wafer picking file in the format required by each manufacturer, and the wafer picking file in various formats can be converted by using only one conversion program, so that the complexity of program development and test is reduced while the differentiated requirements are met, the program running speed is increased, and the operation is simple.

Description

technical field [0001] The invention belongs to the field of integrated circuits, and more specifically relates to a method and system for converting a wafer Map file into a pick-up file. Background technique [0002] Wafers are silicon wafers used in the manufacture of silicon semiconductor integrated circuits. Because of their circular shape, they are called wafers. A semiconductor chip is a circuit made on a wafer through various complex physical and chemical methods, and different electrical functions are tested in the final stage of generation to ensure the functionality of the product, and the graphics generated by combining the test results with the shape of the wafer It is the Map file of the wafer, that is, the wafer map (Wafer Map), and the Map file is in binary format. The Map file takes the chip (Die) as the unit, and the test results of each chip are represented by different colors, such as figure 1 shown. [0003] When picking up slices, it is necessary to c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F8/73
CPCY02P90/30
Inventor 周乃新李建国
Owner BEIJING CHIPADVANCED