An anti-collision LED packaging structure with efficient heat dissipation function

Abstract

The invention discloses an anti-collision LED packaging structure with an efficient heat dissipation function. The structure includes a substrate, an LED chip, pins and a base. The upper end of the substrate is connected with an LED chip. The base is arranged at the lower end of the substrate, the pins are arranged at the two ends of the base respectively, the two ends of the substrate are both connected with heat conduction silica gel, one side of the heat conduction silica gel is connected with a heat dissipation opening, one side of the heat dissipation opening is connected with a spring, the lower end of the substrate is connected with a support, and the substrate is connected with the base through the support. The two sides of the substrate are both connected with the heat conductionsilica gel; a heat dissipation port is connected to one side; meanwhile, air holes are formed in the base; the heat dissipation effect of the LED packaging structure is improved, an anti-collision block is connected to the upper end of the heat conduction silica gel, the spring is connected to one side of the heat dissipation opening, the all-dimensional anti-collision performance of the LED packaging structure is enhanced, and the LED packaging structure can be effectively protected from being damaged by arranging the groove in the support.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to an anti-collision LED packaging structure with efficient heat dissipation function. Background technique [0002] LED (light-emitting diode) packaging refers to the packaging of light-emitting chips. Compared with integrated circuit packaging, it is quite different. LED packaging is not only required to protect the wick, but also to be able to transmit light. Generally speaking, the function of packaging is to provide enough for the chip. protection to prevent the chip from failing due to long-term exposure in the air or mechanical damage, so as to improve the stability of the chip; for LED packaging, it is also necessary to have good light extraction efficiency and good heat dissipation. Good packaging can make LEDs have better performance. Luminous efficiency and heat dissipation environment, thereby improving the life of LEDs, but the heat dissipation performance of the ...

AI Technical Summary

Problems solved by technology

[0002] LED (light-emitting diode) packaging refers to the packaging of light-emitting chips. Compared with integrated circuit packaging, it is quite different. LED packaging is not only required to protect the wick, but also to be able to transmit light. Generally speaking, the function of packaging is to provide enough for the chip. protection to prevent the chip from failing due to long-term exposure in the air or mechanical damage, so as to improve the stability of the chip; for LED packaging, it is also necessary to have good light extraction efficiency and good heat dissipation. Good packaging can make LEDs have better performance. Luminous efficiency and heat dissipation environment, thereby improving the life of LEDs, but the heat dissipation performance of the traditional LED package structure needs to be improved, because the heat dissipation components are relatively single and cannot form a circular coordination effect, the heat dissipation effect is not good, affecting the stability of use, and The traditional LED packaging structure does not have a certain anti-collision performance, and lacks corresponding components in the protection of the substrate and LED chips, which affects its service life

Images