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2results about How to "Effective cooling function" patented technology

A handheld cooling fan

ActiveCN224533040UEffective cooling functionSolve the problem of fast power consumption and no cooling effect
The utility model discloses a handheld refrigeration fan belongs to portable electric appliance technical field, including handle, head shell, circuit control module, cold end module and hot end module, the circuit control module is installed on handle, the lower extreme of head shell is integrative and has the connecting block, the centre of head shell inner chamber is provided with the baffle, the centre of baffle surface installs with the Peltier semiconductor of cold end module and hot end module cooperation use, divides the internal cavity of head shell through setting baffle, divides out the cold air duct and hot air duct that do not communicate with each other, and the independent cold end fan and hot end fan are matched, make the cold air that cold end produces can directly from the front air outlet blow to the user, and the heat that hot end absorbs then exports from the independent exhaust port of side rear, ensure that the temperature that blows to the user is the pure cold wind that is significantly lower than ambient temperature, thereby realize efficient refrigeration function, solved the problem that the existing product power consumption block has no refrigeration effect.
Owner:DACHUAN AUTOMATION EQUIPMENT (TIANJIN) CO LTD

A standard power cell structure fabrication method for embedded packaging

ActiveCN122179999BEffective cooling functionreduce manufacturing cost
This invention relates to the field of advanced integrated circuit packaging technology, specifically to a method for manufacturing a standard power cell structure for embedded packaging. The method includes the following steps: obtaining design parameters for all standard power cells; performing patterned electroplating on one end of a copper plate to form a chip housing cavity and alignment target; creating blind slots in the copper plate to form an insulating area and a cutting area; dividing the copper plate into multiple copper bases; retaining the layered structure of the copper plate as a connecting layer; mounting the chip to the chip housing cavity; encapsulating the entire board; opening windows; laser drilling and metallizing to form interconnect vias and top external vias; manufacturing a redistribution layer to form half-bridge circuits, full-bridge circuits, cascaded circuits, multi-core series circuits, multi-core parallel circuits, or single-core circuits; removing the connecting layer; and cutting to obtain the standard power cell product. This invention enables batch manufacturing of standard power cells with efficient heat dissipation and different circuit structures, including multi-core series structures.
Owner:SHENZHEN SIPTORY TECH CO LTD