Electronic equipment with asymmetrical heat dissipation structure

Abstract

The invention provides electronic equipment with an asymmetrical heat dissipation structure, which comprises a PCB (printed circuit board) substrate, a heat conducting metal core installed in the PCB substrate, and a miniature high-power device installed on the heat conducting metal core, wherein the heat conducting metal core comprises a base part and a protruding part extending from the base part, the size of the protruding part corresponds to that of the miniature high-power device, the size of the base part is greater than that of the protruding part, and the miniature high-power device is installed on the protruding part. The electronic equipment provided by the invention realizes effective heat dissipation of the high-power miniature device through the asymmetrical heat conducting metal core installed in a first slot part and a second slot part; the surface area of the PCB substrate is not occupied, an intensive circuit pattern design around the high-power miniature device is not affected, and the flexibility is high; and the effective heat dissipation area of the asymmetrical heat conducting metal core is large, and a function of effective heat dissipation of a partial micro area of the PCB substrate is realized.

Description

technical field [0001] The invention relates to the field of heat dissipation of electronic equipment, in particular to an electronic equipment with an asymmetric heat dissipation structure. Background technique [0002] At present, there is a design for high-end wireless communication in the printed circuit board (PCB) industry: one side of the PCB is designed with miniature high-power devices (≤2mm), and there are denser circuit graphics designs around the devices, which require communication with the inner layer; On the other side of the PCB corresponding to the micro high-power device area, the graphics design density is not high, but heat sinks need to be mounted to dissipate the large amount of heat generated by the micro high-power devices. [0003] The conventional PCB solution is to use heat-conducting plates and dense heat dissipation holes for high-power device areas, but the heat conduction effect of heat-conducting plates and dense heat-dissipating holes is not ...

AI Technical Summary

Problems solved by technology

[0003] The conventional PCB solution is to use heat-conducting plates and dense heat dissipation holes for high-power device areas, but the heat conduction effect of heat-conducting plates and dense heat-dissipating holes is not good, and the dielectric loss coefficient of the plates is large, resulting in poor heat dissipation in the area of ​​micro high-power devices. , Signal transmission loss and distortion are serious, which affects the signal quality of communication products

[0004] Another solution to heat-dissipating PCBs is to use laminated embedding or embedding heat-conducting materials as heat-conducting channels in the high-power device area.

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