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Systems, apparatus, and methods for an improved load port backplane

A loading port and backplane technology, which is applied in the direction of transportation and packaging, electrical components, conveyor objects, etc., can solve problems such as the difficulty of sealing conventional backplanes

Active Publication Date: 2019-06-25
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it can be difficult to reliably seal conventional backsheets against EFEMs

Method used

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  • Systems, apparatus, and methods for an improved load port backplane
  • Systems, apparatus, and methods for an improved load port backplane
  • Systems, apparatus, and methods for an improved load port backplane

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Embodiment Construction

[0016] Embodiments described herein provide systems, apparatus, and methods for improved loadport backplanes that allow for reliable sealing of loadports to equipment front-end modules (EFEMs) of electronics manufacturing systems. An EFEM typically includes a transfer robot in a closed, positive pressure, non-reactive gas (eg, nitrogen) environment, and the EFEM is mounted to a substrate processing tool. EFEMs enable transfer of substrates (eg, without exposure to reactive gases or other contaminants) between a substrate carrier docked on a load port (eg, in a clean room environment) and a substrate processing tool. A seal is maintained between the backplate of the loadport and the EFEM. However, securing a conventional loadport backplate to the front of the EFEM such that the two surfaces are coplanar and compress the seal uniformly can be difficult due to the weight of the loadport. In other words, conventional backplanes do not include mounting hardware that enables easy a...

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PUM

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Abstract

Embodiments provide systems, apparatus, and methods for an improved load port that includes a backplane assembly supporting a docking tray and a substrate carrier opener, wherein the backplane assembly includes a backplane, a leveling block coupleable to an equipment front end module (EFEM), a conical hole adjustment assembly coupled between the leveling block and the backplane, and a slotted holeadjustment assembly coupled between the leveling block and the backplane. The conical hole adjustment assembly includes a conical hole block coupled to the leveling block at a first end; a threaded block coupled to the backplane, and an adjustment bolt coupled to the conical hole block and the threaded block. Numerous additional aspects are disclosed.

Description

[0001] related application [0002] This case claims U.S. nonprovisional patent application entitled "SYSTEMS, APPARATUS, ANDMETHODS FOR AN IMPROVED LOAD PORT BACKPLANE" filed on November 10, 2016 Priority of Ser. No. 15 / 348,964 (Attorney Docket No. 24538-01 / USA), which is hereby incorporated by reference in its entirety for all purposes. technical field [0003] The present application relates to electronic device manufacturing systems, and more particularly to systems, apparatus, and methods for improved loadport backplanes. Background technique [0004] An equipment front-end module (EFEM), sometimes referred to as a factory interface (FI), provides a non-reactive environment for transferring substrates from carriers to processing tools. This is accomplished by sealing the interior volume of the EFEM as closely as possible and injecting a gas, such as nitrogen, that is substantially non-reactive with the substrate material into the interior volume. The non-reactive gas ...

Claims

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Application Information

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IPC IPC(8): H01L21/677
CPCH01L21/67772H01L21/67775H01L21/67778H01L21/67383
Inventor 保罗·B·路透道格拉斯·B·鲍姆加滕
Owner APPLIED MATERIALS INC