Fabrication method of transparent conductive film structure
A technology of transparent conductive film and production method, which is applied in the direction of equipment for manufacturing conductive/semiconductive layers, cable/conductor manufacturing, circuits, etc., can solve the problems of complicated process steps, residual conductive paste, high production cost, etc., and achieve The effect of simplifying the process flow, avoiding residues and reducing production costs
Active Publication Date: 2021-03-30
SUZHOU LANPEI OPTOELECTRONICS TECH CO LTD
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Problems solved by technology
[0004] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a method for manufacturing a transparent conductive film structure, which is used to solve the problem of flexibility caused by scraping conductive paste on the upper surface of the flexible material layer in the prior art. There is conductive paste residue on the upper surface of the material layer, so the upper surface of the flexible material layer needs to be cleaned after scraping, which makes the whole process steps more complicated and the production cost is higher
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[0052] The implementation of the present invention will be illustrated by specific specific examples below, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.
[0053] see Figure 2 to Figure 9 . It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification, for those who are familiar with this technology to understand and read, and are not used to limit the implementation of the present invention. Limiting conditions, so there is no technical substantive meaning, any modification of structure, change of proportional relationship or adjustment of size, without affecting the effect and purpose of the present invention, should still fall within the scope of the present invention. The disclosed technical content must be within the scope covered. At the sa...
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Abstract
The invention provides a fabrication method of a transparent conductive film structure. The fabrication method comprises the following steps of providing a printing working platform; arranging a softlining pad on an upper surface of the printing working platform; arranging a flexible lamination structure on an upper surface of the soft lining pad, wherein the flexible lamination structure comprises a flexible substrate and a flexible material layer, the flexible substrate is arranged on the upper surface of the soft lining pad, the flexible material layer is arranged on an upper surface of the flexible substrate, and a plurality of groove structures are formed in an upper surface of the flexible material layer; placing paste on the upper surface of the flexible material layer; scrapping the paste by a scrapping tool so that the paste is filled in each groove structure to form a seed layer; and forming the transparent conductive film structure according to the seed layer. By the fabrication method, the residue of the paste on the surface of the flexible substrate can be prevented, the cleanness of the upper surface of the flexible material layer after scrapping is completed is ensured, the pre-curing step on the paste and the cleaning step on the upper surface of the flexible material layer are not needed, so that the process flow is simplified, the production cost is reduced.
Description
technical field [0001] The invention belongs to the technical field of transparent conductive film structures, and in particular relates to a method for manufacturing a transparent conductive film structure. Background technique [0002] The transparent conductive film structure contained in the touch screen (also known as touch screen) is provided by a plurality of corresponding groove structures on the surface of the flexible material layer, and the transparent conductive film structure is formed in the groove structure. In the existing technology, such as figure 1 As shown, generally, the flexible laminated structure 10 including the flexible substrate 101 and the flexible material layer 102 is placed on the upper surface of a printing platform 12, and the conductive paste 13 is dripped on the upper surface of the flexible material layer 102 using a scraper 14 Scraping the conductive paste 13 so that the conductive paste 13 (for example, paste such as silver paste) is fi...
Claims
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IPC IPC(8): H01B13/00G06F3/041
CPCG06F3/041G06F2203/04103H01B13/0026
Inventor 谢自民冯波郭向阳陈春明平财明王庆军
Owner SUZHOU LANPEI OPTOELECTRONICS TECH CO LTD