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Pressure core body utilizing boss structure sintering base

A technology of boss structure and core body, which is applied in the field of sensitive components, can solve problems such as glue overflow and affect the performance of pressure chips, and achieve the effects of bearing pressure evenly, improving output accuracy, and protecting chips

Pending Publication Date: 2019-08-02
NANJING WOTIAN TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] During the packaging process of the existing pressure core body, the core component pressure chip is mainly fixed on the sintered base by glue. In actual operation, due to excessive glue application, the excess glue overflows around the chip and affects the pressure chip. performance

Method used

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  • Pressure core body utilizing boss structure sintering base
  • Pressure core body utilizing boss structure sintering base
  • Pressure core body utilizing boss structure sintering base

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Embodiment Construction

[0017] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them.

[0018] refer to figure 1 , a pressure core with a sintered base with a boss structure, including a chip (1), a sintered base (2), a pressure ring (3), a diaphragm (4), a ceramic pad (5), and an O-ring (6) , a glass insulator (7), the sintered base (2) is provided with an oil filling hole (8), the filling oil (9) can be poured into the cavity of the core body through the oil filling hole (8), and the pressure ring ( 3), the diaphragm (4) is connected to the sintered base (2) by welding, the sintered base (2) has a boss (10) structure, and the area of ​​the bottom surface of the boss (10) is the same as that of the chip (1) The bottom surface area differ...

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Abstract

The invention discloses a pressure core body utilizing a boss structure sintering base and belongs to the technical field of sensitive components. The core body includes a chip, a sintering base, a pressure ring, a diaphragm, a ceramic pad, an O-shaped ring and a glass insulator, wherein the sintering base is provided with an oil hole, oil can be filled into a cavity of the core body through the oil hole, the pressure ring and the diaphragm are connected with the sintering base through welding, the sintering base has a boss structure, difference between the area of the bottom surface of the boss structure and the area of a bottom surface of the chip is within + / -8 mm<2>, and the chip is fixed to a boss through gluing. Compared with a pressure core body of a common sintering base, the corebody is advantaged in that 1, the chip is fixed on the sintering base through gluing, the excess glue is prevented from spilling around the chip, and chip performance is improved; and 2, the chip is evenly stressed, and sensor output accuracy is improved.

Description

technical field [0001] The invention relates to the technical field of sensitive components, in particular to a pressure core with a boss structure sintered base. Background technique [0002] During the packaging process of the existing pressure core body, the core component pressure chip is mainly fixed on the sintered base by glue. In actual operation, due to excessive glue application, the excess glue overflows around the chip and affects the pressure chip. performance. To solve this problem, our company has developed a sintered base with boss structure. Contents of the invention [0003] In view of the above-mentioned shortcomings existing in the prior art, the present invention aims to propose a pressure core body that adopts a boss structure sintered base, and a cylinder / cuboid boss is designed at the central position of the sinter base, and the cylinder / cuboid boss The bottom surface area of ​​the chip is similar to the bottom surface area of ​​the chip. The chi...

Claims

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Application Information

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IPC IPC(8): H01L23/13G01L1/00
CPCG01L1/00H01L23/13
Inventor 高峰张仁政
Owner NANJING WOTIAN TECH
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