Cooling fin fixing mechanism of chip, cooling device and installation method of cooling fin fixing mechanism

A fixing mechanism and heat dissipation device technology, which is applied in the direction of electric solid-state devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve the problem of damaging the core of the chip, achieve the effect of protecting the chip and prolonging the service life

Pending Publication Date: 2022-04-12
XIAN YIPU COMM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, on a chip without a metal protective case (such as a TH5 chip), when using the existing method to fix the heat sink, there will be a great risk of damaging the core Die of the chip.

Method used

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  • Cooling fin fixing mechanism of chip, cooling device and installation method of cooling fin fixing mechanism
  • Cooling fin fixing mechanism of chip, cooling device and installation method of cooling fin fixing mechanism
  • Cooling fin fixing mechanism of chip, cooling device and installation method of cooling fin fixing mechanism

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Embodiment Construction

[0026] In order to describe the technical content, structural features, and achieved effects of the present invention in detail, the following will be described in detail in conjunction with the embodiments and accompanying drawings.

[0027] like image 3 and Figure 4 As shown, the heat dissipation device 100 of the present invention is used to dissipate heat from the chip 201, which includes a heat sink 1, a fixed bracket 2 and a heat sink fixing mechanism 3, the chip 201 is arranged on a PCB 200, and the PCB 200 is placed on the fixed bracket 2, the heat sink 1 is arranged above the fixed support 2 and pressed on the chip 201. The heat sink fixing mechanism 3 is connected between the fixed support 2 and the heat sink 1, so that the heat sink 1 is positioned on the fixed support 2, and the chip 201 and the PCB 200 are placed against the heat sink 1 by the heat sink 1. Press on the fixed bracket 2. Specifically, the heat sink fixing mechanisms 3 are distributed around the...

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PUM

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Abstract

The invention discloses a cooling fin fixing mechanism of a chip, a cooling device and a mounting method of the cooling device, which are used for positioning a cooling fin on a fixing bracket and comprise a connecting piece, an elastic piece and a fastening mechanism, one end of the connecting piece is connected to the fixed bracket; the elastic piece is arranged between the connecting piece and the cooling fin so as to provide elastic force enabling the cooling fin to slide towards the direction of the fixing support. The fastening mechanism is arranged between the connecting piece and the cooling fin so as to lock or unlock the relative position of the cooling fin and the connecting piece after the elastic piece elastically abuts against the cooling fin. The radiating fin can be prevented from shaking when bearing vibration impact, the chip is prevented from being crushed, the structure is simple, assembly is convenient, and the service life of the chip is effectively prolonged.

Description

technical field [0001] The invention relates to the field of chip heat dissipation, in particular to a heat sink fixing mechanism for a chip, a heat dissipation device and an installation method thereof. Background technique [0002] Due to the high power consumption and high heat generation of existing high-power chips, it is necessary to install a heat sink to dissipate heat from the chip. The heat sink is generally pressed tightly on the core die surface of the chip. The traditional heat sink 300 such as figure 1 and figure 2 As shown, the structure for positioning the heat sink 301 is mostly fixed by a combination of screws 302 and springs 303 . When the product vibrates and impacts, the heat sink 301 will shake along with the product, and this shaking will form an impact on the chip 400 . Existing chips basically have a metal protective shell to protect the core die of the chip. When the metal protective shell product of the chip is subjected to vibration and shock, ...

Claims

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Application Information

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IPC IPC(8): H01L23/367H01L21/48H01L23/40
Inventor 钟发春
Owner XIAN YIPU COMM TECH
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