Waterproof fingerprint module
A fingerprint module and fingerprint chip technology, which is applied in the acquisition/organization of fingerprints/palmprints, character and pattern recognition, instruments, etc., can solve the problems that affect the connection effect between the metal ring and the circuit substrate, and affect the waterproof performance of the fingerprint module, etc. Achieve the effect of avoiding bad risks, improving product production qualification rate, and improving product quality
Pending Publication Date: 2019-08-23
昆山丘钛生物识别科技有限公司
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Problems solved by technology
[0003] The metal ring is enlarged and topped by the expansion gas, and the adhesive layer and glue are washed away by the expansion gas, which affects the connection effect between the metal ring and the circuit substrate, and seriously affects the waterproof performance of the fingerprint module.
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[0024] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.
[0025] Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art wi...
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The invention provides a waterproof fingerprint module, and relates to the technical field of fingerprint modules. The waterproof fingerprint module comprises a metal ring, a fingerprint chip and a circuit substrate. The fingerprint chip is connected to the circuit substrate, the metal ring is connected with the circuit substrate, and the fingerprint chip is located at the inner side of the metalring. One end, far away from the circuit substrate, of the metal ring extends inwards in the radial direction to form a protruding part, and the protruding part covers the upper edge of the fingerprint chip; at least one exhaust groove is formed in the protruding part. The waterproof fingerprint module has the good waterproof performance, and gas can be exhausted from the exhaust grooves in the adhesive layer baking and curing process, so the product percent of pass is increased.
Description
technical field [0001] The invention relates to the technical field of fingerprint modules, in particular to a waterproof fingerprint module. Background technique [0002] In the conventional fingerprint module design, the metal ring is isolated from the inside of the whole machine by pasting glue to achieve waterproofing inside the whole machine. However, in the actual production process, the metal ring, the fingerprint chip and the circuit substrate will form a sealed cavity after the glue and the adhesive layer are bonded. During the baking and curing process, the gas in the sealed cavity will expand due to heat, resulting in the following defects risk: [0003] The metal ring is enlarged and topped by the expansion gas, and the adhesive layer and glue are washed away by the expansion gas, which affects the connection effect between the metal ring and the circuit substrate, and seriously affects the waterproof performance of the fingerprint module. Contents of the inve...
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IPC IPC(8): H01L23/31G06K9/00
CPCH01L23/3107G06V40/12
Inventor 邹兵
Owner 昆山丘钛生物识别科技有限公司