Vertical-structure miniature light-emitting diode display panel and manufacturing method thereof

Abstract

The invention provides a miniature light-emitting diode display panel with a vertical structure and a manufacturing method thereof. The manufacturing method comprises the following steps: S1, formingfirst electrodes distributed in an array on a bottom back plate; S2, bonding a vertical miniature diode on the first electrode of the bottom backboard through a bonding process; S3, depositing a filling layer covering the vertical miniature diode; S4, performing exposure and development on the filling layer and forming an opening on the vertical miniature diode; and then depositing a first metal layer, and patterning the first metal layer to form first conduction electrodes located in the opening and second conduction electrodes located between every two adjacent first conduction electrodes. According to the invention, high-temperature and high-pressure actions are avoided, so that the characteristic influence and the adverse risk of a semiconductor are solved, and the high-cost loss of the backboard caused by the adverse effect is reduced.

Description

technical field [0001] The invention relates to the technical field of micro light emitting diodes, in particular to a vertical structure micro light emitting diode display panel and a manufacturing method thereof. Background technique [0002] With the vigorous development of the display industry, micro light-emitting diodes (Micro LEDs) have entered the stage of the times as a new generation of display technology. Compared with the existing OLED and LCD technologies, they have higher brightness, lower power consumption, better luminous efficiency and The advantages of longer life, but there are still many problems to be solved in Micro LED. Whether it is process technology, inspection standards, or manufacturing costs, there is a long way to go with mass production and commercial applications. Since the size of Micro LED is generally less than 100 μm, and the quantity to be transferred is large, one of the most important challenges is how to transfer a huge amount of Micro...

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Problems solved by technology

[0003] The micro-LEDs are placed on the lower electrode of the drive backplane by mass transfer, and then the upper electrode is formed after planarization and insulating layers, so that the lower electrode and the upper electrode are turned on. After the transfer, it needs to be connected to the backplane through metal bonding. The metal bonding process requires certain high temperature and high pressure conditions. At this time, it will have a certain impact on the characteristics of the semiconductor backplane, and it may cause internal damage to the semiconductor layer and cause adverse effects. risk

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