Preparation method of solar module
A solar module and assembly structure technology, applied in electrical components, semiconductor devices, photovoltaic power generation, etc., can solve problems such as tight demand for laminator, low production efficiency, and labor waste, so as to save labor, improve production efficiency, and reduce production. Cost and effect of equipment wear and tear
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Embodiment 1
[0041] The invention provides a method for preparing a solar module. The solar module includes a base cloth, a fourth adhesive film layer, a back plate, a first adhesive film layer, a chip, a second adhesive film layer, a water-blocking film, a third adhesive film layer and foreboard. Such as figure 1 As shown, the base cloth 17, the fourth adhesive film layer 15, the back plate 13, the first adhesive film layer 11, the chip 1, the second adhesive film layer 12, the water blocking film 14, the third adhesive film layer 16 and the front plate 18 are stacked sequentially from bottom to top to obtain an assembly structure of solar modules.
[0042]Further, the base fabric, the fourth adhesive film layer, the back plate, the first adhesive film layer, the chip, the second adhesive film layer, the water-blocking film, the third adhesive film layer and the front plate are stacked in sequence from bottom to top During the process, it is necessary to stack and place according to the...
Embodiment 2
[0064] The difference between this embodiment and Embodiment 1 is only in the setting of the lamination process parameters, which specifically include the following:
[0065] The first step is to evacuate the upper chamber and the lower chamber at the same time, set the time for the above steps to 1 minute, keep the vacuum degree of the upper chamber and the lower chamber at -90Kpa, and maintain the temperature at 140°C;
[0066] The second step is to adjust the vacuum degree of the upper chamber in sections, while maintaining the vacuum degree of the lower chamber at -90Kpa and maintaining the temperature at 140°C, including:
[0067] One-step vacuum adjustment: adjust the vacuum degree of the upper chamber to -80Kpa; at the same time, evacuate the lower chamber, set the time for the above steps to 2 minutes, keep the vacuum degree of the lower chamber at -90Kpa, and maintain the temperature at 140°C;
[0068] Two-stage vacuum degree adjustment: adjust the vacuum degree of th...
Embodiment 3
[0073] The difference between this embodiment and Embodiment 1 and Embodiment 2 lies in the parameter setting of the lamination molding process, which specifically includes the following:
[0074] The first step is to evacuate the upper chamber and the lower chamber at the same time, set the time for the above steps to 3 minutes, keep the vacuum degree of the upper chamber and the lower chamber at -100Kpa, and maintain the temperature at 160°C;
[0075] The second step is to adjust the vacuum degree of the upper chamber in sections, while maintaining the vacuum degree of the lower chamber at -100Kpa and maintaining the temperature at 160°C, including:
[0076] One-step vacuum adjustment: adjust the vacuum of the upper chamber to -60Kpa; at the same time, vacuum the lower chamber, set the time for the above steps to 4 minutes, keep the vacuum of the lower chamber at -100Kpa, and maintain the temperature at 160°C;
[0077] Two-stage vacuum degree adjustment: adjust the vacuum de...
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Abstract
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