Housing assembly, method for manufacturing same, and electronic device

A shell assembly and shell technology, which is applied in the direction of electrical equipment shells/cabinets/drawers, electronic equipment, sub-office equipment, etc., can solve problems such as the difficulty of laminating transparent substrates and appearance diaphragms

Active Publication Date: 2019-08-30
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The inventors found that currently, when using a transparent substrate with a relatively large bending angle to make the casing of an electronic device, there are problems such as difficulty in laminating the transparent substrate and the appearance film.

Method used

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  • Housing assembly, method for manufacturing same, and electronic device
  • Housing assembly, method for manufacturing same, and electronic device
  • Housing assembly, method for manufacturing same, and electronic device

Examples

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Embodiment Construction

[0023] Embodiments of the application are described in detail below, examples of which are illustrated in the accompanying drawings. The embodiments described below by referring to the figures are exemplary, and are intended to explain the present application, and should not be construed as limiting the present application.

[0024] In one aspect of the present application, the present application proposes a housing assembly. According to the embodiment of this application, refer to figure 1 , the housing assembly 1000 includes: a housing base 100 and an appearance diaphragm 200 , and the appearance diaphragm 200 is disposed on one side of the housing base 100 . refer to figure 1 as well as figure 2 , the housing base 100 has a bottom surface 110, and a side wall 120 connected to the bottom surface 110 (the side walls 120 can be two oppositely arranged, or can be figure 2 4 sidewalls 120 connected to each other shown in ), the bending angle between the sidewall 120 and t...

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PUM

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Abstract

The application discloses a housing assembly, a method for manufacturing the same, and an electronic device. Specifically, the application provides a housing assembly. The housing assembly comprises ahousing base having a bottom surface and a side wall connected to the bottom surface, wherein a bending angle between the side wall and the bottom surface is greater than 70 degrees; and an appearance diaphragm disposed on a side of the housing base and including a flexible substrate; and a mirror silver layer disposed on a side of the flexible substrate, wherein the flexible substrate has an elastic modulus of 800 to 2000 MPa. Therefore, the housing assembly has a large curvature, the appearance diaphragm and the housing base are closely attached, and the housing assembly has a good appearance and can achieve a metallic luster effect while not plated with a metal film, and has good product performance.

Description

technical field [0001] The present application relates to the field of electronic equipment, in particular, to a housing assembly, a preparation method thereof, and an electronic equipment. Background technique [0002] With the continuous development of preparation technology in the field of electronic equipment, housing materials for electronic equipment are also abundant. Glass material has the characteristics of good light transmittance, corrosion resistance, heat resistance and easy processing, etc. Film decoration has the characteristics of easy processing, cheap price and diversified appearance, so it is made by transparent substrate and decorative film Electronic equipment enclosures are used in a very wide range of applications. For example, the battery back covers of many mobile phones use a glass shell and a diaphragm to achieve the appearance effect. [0003] However, the current casing components, their preparation methods, and electronic devices still need to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/02B44C5/04B44C3/02
CPCH05K5/0243B44C5/0407B44C3/02B44C5/04C09D11/037H04M1/0262H04M1/0202H04M1/0283B32B7/023B32B27/16B32B38/145B32B2255/10B32B2255/26B32B2307/4023B32B2307/406B32B2307/414B32B2307/546B32B2307/732B32B2457/00
Inventor 武鑫毕四鹏侯体波
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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