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Intelligent power module manufacturing tool and method

A technology of intelligent power modules and manufacturing methods, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., and can solve problems such as deformation, flexible mounting substrate depression, chapping, etc.

Active Publication Date: 2019-09-27
GD MIDEA AIR-CONDITIONING EQUIP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The main purpose of the present invention is to provide a manufacturing tooling and method for an intelligent power module, aiming to solve the problem that the flexible mounting substrate is prone to dents, deformation or cracks during the manufacturing process of the intelligent power module

Method used

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  • Intelligent power module manufacturing tool and method
  • Intelligent power module manufacturing tool and method
  • Intelligent power module manufacturing tool and method

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Embodiment Construction

[0039] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0040] The invention provides a manufacturing tool for an intelligent power module.

[0041] refer to figure 1 , the intelligent power module 300 includes: a heat dissipation layer 310, an insulating substrate 320, and a flexible copper clad layer 330, the flexible copper clad layer 330 and the heat dissipation layer 310 are separately arranged on both sides of the insulating substrate 320; the flexible copper clad layer There are multiple pin mounti...

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Abstract

The invention discloses an intelligent power module manufacturing tool and method. The intelligent power module comprises a heat dissipation layer, an insulating substrate and a flexible copper-clad layer, wherein the orthographic projection of the heat dissipation layer on the insulating substrate and the flexible copper-clad layer is located in the edge of the insulating substrate and the flexible copper-clad layer. The manufacturing tool comprises a support structure and a fixing frame, wherein a support position is provided with a first support portion for supporting the heat dissipation layer and a second support portion for supporting the insulating substrate, the second support portion is disposed around the first support portion and the height difference between the second support portion and the first support portion is equal to the thickness of the heat dissipation layer; and the fixing frame comprises a frame portion and multiple first conductive strips extending inward from the frame portion, the multiple first conductive strips are welded on the mounting positions of the flexible copper-clad layer, and thus, pins of the intelligent power module are formed. The problems that in the intelligent power module manufacturing process, as the flexible mounting substrate is hard to fix, the flexible mounting substrate is too soft and is likely to be sunken, and deformation or splitting happens can be solved.

Description

technical field [0001] The invention relates to the technical field of electronic circuits, in particular to a manufacturing tool and method for an intelligent power module. Background technique [0002] Intelligent Power Module (IPM for short) is a power device with IGBT ((Insulated Gate Bipolar Transistor)), which wins an increasing market due to its advantages of high integration and high reliability. In order to reduce the size of the smart power module, when a thinner substrate is used as the mounting substrate, it is difficult to fix the flexible mounting substrate during the manufacturing process of patching, wire binding, packaging, etc., and the flexible mounting substrate is prone to dents, resulting in Deformation or cracking problems. Contents of the invention [0003] The main purpose of the present invention is to provide a manufacturing tool and method for an intelligent power module, aiming at solving the problem that the flexible mounting substrate is pro...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/50H01L21/56H01L21/60
CPCH01L21/50H01L21/561H01L21/565H01L21/67121H01L21/67126H01L24/93H01L2224/48091H01L2924/181H01L2924/00014H01L2924/00012
Inventor 刘东子冯宇翔
Owner GD MIDEA AIR-CONDITIONING EQUIP CO LTD
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