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Manufacturing tooling and method of intelligent power module

A technology of intelligent power modules and manufacturing methods, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve problems such as sag, chapping, and deformation of flexible mounting substrates, and achieve the effect of improving manufacturing convenience

Active Publication Date: 2021-05-28
GD MIDEA AIR-CONDITIONING EQUIP CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The main purpose of the present invention is to provide a manufacturing tooling and method for an intelligent power module, aiming to solve the problem that the flexible mounting substrate is prone to dents, deformation or cracks during the manufacturing process of the intelligent power module

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  • Manufacturing tooling and method of intelligent power module
  • Manufacturing tooling and method of intelligent power module
  • Manufacturing tooling and method of intelligent power module

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Embodiment Construction

[0039] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0040] The invention provides a manufacturing tool for an intelligent power module.

[0041] refer to figure 1 , the intelligent power module 300 includes: a heat dissipation layer 310, an insulating substrate 320, and a flexible copper clad layer 330, the flexible copper clad layer 330 and the heat dissipation layer 310 are separately arranged on both sides of the insulating substrate 320; the flexible copper clad layer There are multiple pin mounti...

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Abstract

The invention discloses a tooling and method for manufacturing an intelligent power module. The intelligent power module includes: a heat dissipation layer, an insulating substrate and a flexible copper clad layer. The orthographic projection of the heat dissipation layer on the insulating substrate and the flexible copper clad layer is located Inside the edge of the copper layer; the manufacturing tooling includes: a support structure, a first support part for supporting the heat dissipation layer and a second support part for supporting the insulating substrate are arranged on the support position, and the second support part is arranged around the first support part , the height difference between the second support portion and the first support portion is equal to the thickness of the heat dissipation layer; the fixed frame includes a frame portion and a plurality of first conductive strips extending inward from the frame portion, and the plurality of first conductive strips are welded on The installation position of the flexible copper clad layer is used to form the pins of the intelligent power module. The invention solves the problem of deformation or chapping because it is difficult to fix the flexible installation substrate and the flexible installation substrate is too soft to be sunken during the manufacturing process of the intelligent power module.

Description

technical field [0001] The invention relates to the technical field of electronic circuits, in particular to a manufacturing tool and method for an intelligent power module. Background technique [0002] Intelligent Power Module (IPM for short) is a power device with IGBT ((Insulated Gate Bipolar Transistor)), which wins an increasing market due to its advantages of high integration and high reliability. In order to reduce the size of the smart power module, when a thinner substrate is used as the mounting substrate, it is difficult to fix the flexible mounting substrate during the manufacturing process of patching, wire binding, packaging, etc., and the flexible mounting substrate is prone to dents, resulting in Deformation or cracking problems. Contents of the invention [0003] The main purpose of the present invention is to provide a manufacturing tool and method for an intelligent power module, aiming at solving the problem that the flexible mounting substrate is pro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/50H01L21/56H01L21/60
CPCH01L21/50H01L21/561H01L21/565H01L21/67121H01L21/67126H01L24/93H01L2224/48091H01L2924/181H01L2924/00014H01L2924/00012
Inventor 刘东子冯宇翔
Owner GD MIDEA AIR-CONDITIONING EQUIP CO LTD
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