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Efficient street lamp bulb bead package method

A light bulb and lamp bead technology, applied in the direction of circuits, electrical components, semiconductor devices, etc., can solve the problems of low product quality, slow installation speed, complex process, etc., meet electrical requirements, avoid over-baking, and solve complex process problems Effect

Inactive Publication Date: 2019-10-15
严伯勤 +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention provides a packaging method for high-efficiency street light bu

Method used

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  • Efficient street lamp bulb bead package method

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Embodiment Construction

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0023] see figure 1 As shown, an embodiment provided by the present invention; a packaging method for high-efficiency street light bulb lamp beads, including the following steps:

[0024] S1: Use ultrasonic waves to clean the bracket of the lamp bead, and at the same time use a chip expander to expand the adhesive film of the chip. The bracket of the lamp bead is a copper substrate;

[0025] S2: Then wake up and stir the cured glue, and then put the treated c...

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Abstract

The invention discloses an efficient street lamp bulb bead package method, which comprises the following steps: S1) cleaning a lamp bulb bead holder with ultrasonic, and meanwhile, expanding an adhesive film of a chip through a chip expander; S2) waking up and stirring curing adhesive, and then, applying the processed curing adhesive to the corresponding position of the lamp bulb bead holder and installing the expanded chip on a chip poking bench; S3) placing the adhered chip into a baking box for baking; S4) electrically connecting an electrode and the chip together through a gold wire welding machine, and testing the welded gold wire; S5) carrying out glue pouring on the cured chip through a glue pouring machine, and baking the glue-poured semi-product; and S6) carrying out quality detection on the packaged product and carrying out spectral encoding on the product and finally, carrying out package for factory delivery. The method solves the problems that the installation process is complicated, the installation speed is slow, the efficiency is low, and the product quality is low.

Description

technical field [0001] The invention relates to the technical field of street lamp production technology, in particular to a packaging method for lamp beads of high-efficiency street lamp bulbs. Background technique [0002] At present, the installation of high-power bulbs and lamp beads used in street lamps is fixed with screws. This method cannot achieve the consistency of the force of each screw, and it is easy to cause the lamp beads to not stick tightly to the lamp body of the street lamp. High light attenuation, and this kind of process is complicated, and the installation efficiency is low. Contents of the invention [0003] (1) Solved technical problems [0004] Aiming at the deficiencies of the prior art, the present invention provides a packaging method for high-efficiency street light bulb lamp beads, which solves the problems of complicated installation process, slow installation speed, low efficiency, and low product quality. [0005] (2) Technical solution ...

Claims

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Application Information

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IPC IPC(8): H01L33/48
CPCH01L33/483H01L2933/0033
Inventor 楼信满严伯勤
Owner 严伯勤