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A kind of manufacturing method of pcb with partial electric thick gold pad

A production method, electro-thick gold technology, applied in chemical/electrolytic methods to remove conductive materials, printed circuit manufacturing, printed circuits, etc., can solve problems such as permeation and plating, to ensure bonding quality, appearance quality and good performance , the effect of improving quality

Active Publication Date: 2021-07-23
JIANGMEN SUNTAK CIRCUIT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention aims at above-mentioned existing technical defect, provides a kind of manufacturing method of PCB with partial electric thick gold PAD, this method optimizes the manufacturing process, solves the seepage problem that exists when making partial electric thick gold PAD, ensures The appearance quality and performance of the PCB are good

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0029] The method of making a PCB having a local thick gold PAD is included in this embodiment, including the following processing step:

[0030] (1) Turn: According to the size of 520 mm × 620 mm, the core plate is 1.1 mm, the thickness of the copper layer of the core plate is 0.5 Oz.

[0031] (2) Inner line production (negative method): inner layer graphic transfer, coated photosensitive film with vertical coating machine, the film thickness of the photosensitive film controls 8 μm, using a fully automatic exposure machine, exposed 5-6 exposure (21) Exposure tip) Complete inner line exposure; inner layer etching, the core plate after exposure development is etched out of the inner layer line, the inner line width is measured to 3 mil; the inner layer AOI, then check the short circuit of the inner layer line, line Defects such as gap, line pinhole, defective scrap, unleadable products are available to the next process.

[0032] (3) Pressure: The brown rate is contained in accorda...

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PUM

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Abstract

The invention discloses a method for making a PCB with a partial electrical thick gold PAD, which comprises the following steps: sticking a film on a production board, forming an outer layer circuit pattern after exposure and development, and the outer layer circuit pattern includes the PAD; etching to remove the exception The copper layer at the layer circuit pattern, the outer layer circuit is obtained after the film is removed; after copper sinking and full board electroplating, a thin copper layer is plated on the board surface; the anti-electric gold is filled on the board surface of the non-outer circuit part Ink, and make the upper end of the anti-electric gold ink flush with the upper end of the outer circuit; stick a film on the production board, and open a window at the position corresponding to the PAD; first electroplate nickel and thin gold on the PAD, and then on the PAD Thick gold plating on top; Removing the film and anti-electric gold ink on the production board in turn; Removing the thin copper layer by etching to recreate the outer layer circuit; Then the PCB is produced through post-processing. The method of the invention optimizes the manufacturing process, solves the problem of permeation and plating existing in the manufacture of local electric thick gold PADs, and ensures good appearance quality and performance of the PCB.

Description

Technical field [0001] The present invention relates to the field of production of printed circuit boards, and more particularly to a method of fabric having a PCB having a local electrical thick gold PAD. Background technique [0002] The PCB's PAD is the meaning of the pad, which is a portion where the PCB is welded to each other. It is manifested as a naked metal surface with strict requirements of the size and shape. The key is to expose the metal and cannot be covered by the solder weld film. The PAD bit generally needs to perform electrical thickness, that is, plated a certain thickness on the basis of electroplated nickel gold to provide good abrasion resistance, resistance and solderability. [0003] The method of conventional PCB with local thick gold PAD includes: pre-step □ brass, plate electric □ outer graphic 1 (manufactured PAD graphic) □ graphic nickel gold □ thick gold □ retired film 1 □ outer graphic 2 (Production Outer Line Graph) □ Graphic Electro-Plating □ Out...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/18H05K3/10H05K3/06
CPCH05K3/06H05K3/108H05K3/18
Inventor 寻瑞平李显流龚海波徐文中
Owner JIANGMEN SUNTAK CIRCUIT TECH