Electronic device and housing manufacture method thereof

A technology for electronic equipment and casings, which is applied in the production field of electronic equipment and casings, can solve the problems of affecting the service life of electronic equipment with protection performance, unable to provide users with metal touch, low thermal conductivity and strength, etc., and achieves good appearance. effect, ensuring stable installation, material compactness and good mechanical properties

Inactive Publication Date: 2014-12-17
LENOVO (BEIJING) CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Since the processing technology and cost of non-metallic materials are superior to those of metal materials, it is generally formed by electroplating or sputtering on non-metallic materials to obtain a metallic texture for electronic devices, but this solution still cannot provide users with An experience with a

Method used

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  • Electronic device and housing manufacture method thereof
  • Electronic device and housing manufacture method thereof
  • Electronic device and housing manufacture method thereof

Examples

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Example Embodiment

[0026] In order to further illustrate the technical means and effects adopted by the present invention, the specific implementation, structure, features, and methods of making an electronic device and its housing according to the present invention will be described with reference to the accompanying drawings and preferred embodiments. Its efficacy is detailed as follows:

[0027] The embodiment of the present invention provides an electronic device, such as figure 1 As shown, the electronic equipment at least includes:

[0028] M components, M is a positive integer greater than or equal to 1. The components are, for example, batteries, circuit boards, display screens, and various chips on circuit boards. These components are the core components of electronic equipment. The application environment of electronic equipment is different. In order to protect the components in the electronic equipment, special treatments such as waterproofing, dust-proofing, increasing heat dissipation, ...

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Abstract

The invention discloses an electronic device and a housing manufacture method thereof. The electronic device comprises components and a housing, wherein the housing comprises a first layer made of first metal material, a first surface of the first layer is an appearance face layer of the electronic device, a second surface of the first layer is a first combination layer combined with a second layer made of second metal material, a first surface of the second layer made of second metal material is a second combination layer combined with the first layer, a second surface of the second layer is a structural component layer of the electronic device, the structural component layer is used to fix the components and/ or fix the housing, and the first layer and the second layer are fixed together through the first combination layer and the second combination layer. The electronic device not only can provide a good metallic appearance for a user, but also can guarantee stable installation between each internal electron component and the housing.

Description

technical field [0001] The invention relates to the field of electronic equipment manufacturing, in particular to a manufacturing method of the electronic equipment and its casing. Background technique [0002] In addition to the excellent functions of the current electronic equipment, its dazzling visual experience is also the goal that users and manufacturers are constantly pursuing. The use of metal texture materials on electronic equipment will bring a good sense of visual impact to users. Since the processing technology and cost of non-metallic materials are superior to those of metal materials, it is generally formed by electroplating or sputtering on non-metallic materials to obtain a metallic texture for electronic devices, but this solution still cannot provide users with An experience with a metallic touch. Moreover, the shell of electronic equipment using non-metallic materials has poor compactness, low thermal conductivity and low strength, which directly affec...

Claims

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Application Information

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IPC IPC(8): H05K5/00B22D19/08
Inventor 张成浩
Owner LENOVO (BEIJING) CO LTD
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