Electronic device and housing manufacture method thereof

Abstract

The invention discloses an electronic device and a housing manufacture method thereof. The electronic device comprises components and a housing, wherein the housing comprises a first layer made of first metal material, a first surface of the first layer is an appearance face layer of the electronic device, a second surface of the first layer is a first combination layer combined with a second layer made of second metal material, a first surface of the second layer made of second metal material is a second combination layer combined with the first layer, a second surface of the second layer is a structural component layer of the electronic device, the structural component layer is used to fix the components and / or fix the housing, and the first layer and the second layer are fixed together through the first combination layer and the second combination layer. The electronic device not only can provide a good metallic appearance for a user, but also can guarantee stable installation between each internal electron component and the housing.

Description

technical field [0001] The invention relates to the field of electronic equipment manufacturing, in particular to a manufacturing method of the electronic equipment and its casing. Background technique [0002] In addition to the excellent functions of the current electronic equipment, its dazzling visual experience is also the goal that users and manufacturers are constantly pursuing. The use of metal texture materials on electronic equipment will bring a good sense of visual impact to users. Since the processing technology and cost of non-metallic materials are superior to those of metal materials, it is generally formed by electroplating or sputtering on non-metallic materials to obtain a metallic texture for electronic devices, but this solution still cannot provide users with An experience with a metallic touch. Moreover, the shell of electronic equipment using non-metallic materials has poor compactness, low thermal conductivity and low strength, which directly affec...

AI Technical Summary

Problems solved by technology

Since the processing technology and cost of non-metallic materials are superior to those of metal materials, it is generally formed by electroplating or sputtering on non-metallic materials to obtain a metallic texture for electronic devices, but this solution still cannot provide users with An experience with a metallic touch

Moreover, the shell of electronic equipment made of non-metallic materials has poor compactness, low thermal conductivity and low strength, which directly affects the protection performance of the shell on the internal components of electronic equipment and the service life of electronic equipment.

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