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Memory module

A technology of memory modules and vias, which is applied in the direction of electrical components, electrical solid devices, circuits, etc., and can solve problems such as impact, signal transmission cannot be guaranteed, and DIMM large transmission risk

Active Publication Date: 2019-11-05
INSPUR SUZHOU INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, as the transfer rate of storage modules in memory is getting higher and higher, that is, when memory modules are applied to next-generation memory, DIMMs packaged in DIP will face great transmission risks
Mainly because the memory signal is a single-ended signal, the ability to resist interference is poor
Too long and dense DIP vias increase the degree of interference of adjacent memory signals, making signal transmission unguaranteed, limiting the transmission rate of memory, and affecting the use of next-generation memory technology

Method used

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Embodiment Construction

[0026] The core of this application is to provide a memory module, which connects the DIMM to the substrate through the pad, so that the aperture of the via hole is not limited by the DIP package, increases the wiring space of the substrate, and changes with the transmission rate of the DIMM .

[0027] In order to make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments It is a part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0028] In the prior art, the connection mode of the mem...

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Abstract

The invention discloses a memory module. The memory module comprises a DIMM and a substrate, wherein a bonding pad is arranged on the substrate; the bonding pad is electrically connected with a via hole in the substrate, and the aperture of the via hole is determined according to the mapping relation; the DIMM is welded with the bonding pad, wherein the mapping relation is a mapping relation between the transmission rate of the DIMM and the aperture of the via hole. The DIMM is connected with the substrate through the bonding pad, so that the aperture of the via hole is not limited by DIP packaging, the wiring space of the substrate is increased, and the wiring space is changed along with the change of the transmission rate of the DIMM.

Description

technical field [0001] This application relates to the field of computer hardware design, in particular to a memory module. Background technique [0002] With the continuous development of computers, the memory technology used in computer structures is also constantly updated. In addition to the corresponding upgrade of the memory particles in the memory module to increase the speed, the DIMM (Dual-Inline-Memory-Modules) and PCB (Printed Circuit Board) in the memory module The way the boards are connected also changes with the upgrade. [0003] At present, the connection mode of the memory module in the prior art is generally a DIP (dual inline-pin package technology) connection, that is, the memory module is packaged by DIP. Specifically, the DIMMs in the memory module are inserted and connected to the substrate of the memory module through DIP vias to form a reliable and stable packaging method. [0004] However, as the transmission rate of the storage module in the mem...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/488H01L23/528
CPCH01L23/488H01L23/528H01L2224/16225H01L2924/15192
Inventor 梁磊
Owner INSPUR SUZHOU INTELLIGENT TECH CO LTD
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