A power module and multi-power system
A power module and capacitor board technology, which is applied in the field of power electronics, can solve the problem of lower operating temperature of board-level components
Active Publication Date: 2021-01-08
SUNGROW POWER SUPPLY CO LTD
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Problems solved by technology
[0005] In view of this, the embodiments of the present invention provide a power module and a multi-power system to solve the problem in the prior art that the power module needs to be equipped with corresponding fan assemblies for each board-level component inside it, so as to ensure the The problem that the working temperature is lowered to the allowable range
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[0052] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0053] In order to make the above objects, features and advantages of the present invention more clearly understood, the present invention will be described in further detail below with reference to the accompanying drawings and specific embodiments.
[0054] In this application, the terms "comprising", "comprising" or any other variation thereof are intended to encompass a non-exclusive inclusion such that a process, method, article o...
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The invention provides a power supply module and a multi-power system. The power supply module comprises a fan assembly, an air channel cover plate, a first support plate, a second support plate and at least one board level assembly. Compared with the prior art, the power supply module utilizes the air channel cover plate and the first support plate, the second support plate and the board level assembly to form a first air channel and a second air channel, which are communicated with each other; the fan assembly arranged at the lower end of the second air channel blows outside air into the first air channel and the second air channel, and takes a part of heat of the board level assembly out of the power supply module to dissipate heat for the power supply module; and in addition, when thefan assembly blows the outside air into the first air channel and the second air channel, air flow in the first air channel and the second air channel is accelerated and the first air channel and thesecond air channel realize convection with the outside world through a gap around the board level assembly, so that the heat accumulated around the board level assembly is taken out of the power supply module through the first air channel and the second air channel, and the power supply module is further cooled.
Description
technical field [0001] The invention relates to the technical field of power electronics, in particular to a power supply module and a multi-power supply system. Background technique [0002] At present, multiple power modules are connected in series to form a multi-power system, which can output higher voltage and greater power to meet the power supply needs of more devices. [0003] Usually, the power module is equipped with a fan assembly, which transfers the heat inside the power module to the outside of the power module through convection to ensure that the temperature of the power module is within the allowable range. [0004] However, due to the layout problem inside the power module in the prior art, the board-level components inside the power module will generate heat accumulation during the working process, resulting in their own high temperature, and corresponding fans must be installed for each board-pole component. Components can be used to reduce the temperatu...
Claims
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IPC IPC(8): H02M1/00H05K7/20
CPCH02M1/00H05K7/20909
Inventor 苏金国刘金凤时晓蕾陶高周
Owner SUNGROW POWER SUPPLY CO LTD