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Wafer mounting apparatus and control method

A control method and chip technology, which is applied in the direction of assembling printed circuits, electrical components, electrical components, etc. with electrical components, can solve the problems of low working efficiency of chip mounting equipment, achieve the effect of shortening detection time and improving work efficiency

Active Publication Date: 2019-11-08
深圳德森精密设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The main purpose of the present invention is to propose a chip mounting equipment, to solve the technical problem of low working efficiency of the existing chip mounting equipment

Method used

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  • Wafer mounting apparatus and control method
  • Wafer mounting apparatus and control method
  • Wafer mounting apparatus and control method

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Embodiment Construction

[0022] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary and are intended to explain the present invention, but cannot be construed as limitations to the present invention. Based on the embodiments in the present invention, those skilled in the art do not make creative work premise All other embodiments obtained below all belong to the protection scope of the present invention.

[0023] In order to solve the above technical problems, the present invention proposes a chip mounting equipment, see figure 1 , the wafer mounting equipment includes a controller, a vacuum generator connected to the controller, a drive device 2 and a pressure detection device, the pressure detection device in...

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Abstract

The present invention discloses a wafer mounting apparatus including a controller and a group consisting of a vacuum generator, a driving device and a pressure detecting device which are connected with the controller, wherein the pressure detecting device includes a slide base connected with the output execution end of the driving device, and a group consisting of a nozzle, a first elastic buffermember and a force sensor which are disposed on the slide base; the nozzle includes a nozzle head and a nozzle rod movably passing through the slide base; the bottom of the nozzle rod is connected tothe nozzle head; the top of the nozzle rod is connected to the first elastic buffer member; and the first elastic buffer member is further connected to the force sensor. The wafer mounting apparatus provided by the invention can effectively improve work efficiency. In addition, the present invention also discloses a control method of the wafer mounting apparatus.

Description

technical field [0001] The invention relates to the technical field of chip mounting, in particular to a chip mounting device and a control method. Background technique [0002] In the prior art, the wafer mounting equipment usually includes a motor and a suction nozzle for picking up / placement of the wafer, so as to drive the suction nozzle to move up and down through forward and reverse rotation of the motor. Specifically, the motor rotates forward, so that the suction nozzle with the wafer moved downward, and after reaching the preset position, the wafer is placed on the wafer mounting area of ​​the PCB board, and then the motor reverses, so that the suction nozzle moves upward, thus completing Wafer fixation. [0003] As we all know, in order to make the chip stably placed on the PCB, a certain pressure needs to be applied on the surface of the chip, but if the pressure exceeds a preset range, the chip will be damaged. For this reason, when the suction nozzle is presse...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/30H05K13/04
CPCH05K3/30H05K13/0409
Inventor 周路遥周林
Owner 深圳德森精密设备有限公司