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Circuit board roughening agent

A roughening treatment and circuit board technology, which is applied in the secondary treatment of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the problems affecting the production efficiency, weak corrosion of circuit board, slow etching speed, etc., and achieve improvement The effect of production efficiency, fast roughening speed and constant copper etching rate

Inactive Publication Date: 2019-11-15
惠州市鸿宇泰科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the use of the microetch agent, the etching rate and etching speed of the microetching agent increase first and then decrease rapidly as time goes on. Control and other issues, thus affecting the efficiency of production

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] A circuit board roughening agent, the main components of which include hydrogen peroxide, formic acid and methanol. Wherein, when making 100Kg circuit board roughening treatment agent, its main components are as follows 15Kg of hydrogen peroxide, 5Kg of formic acid and 0.1Kg of methanol, and the remaining components are water.

Embodiment 2

[0015] A circuit board roughening agent, the main components of which include hydrogen peroxide, formic acid and methanol. Wherein, when making 100Kg circuit board roughening agent, its main components are as follows: 30Kg of hydrogen peroxide, 15Kg of formic acid and 0.8Kg of methanol, and the remaining components are water.

Embodiment 3

[0017] A circuit board roughening agent, the main components of which include hydrogen peroxide, formic acid and methanol. Wherein, when making 100Kg circuit board roughening treatment agent, its main components are as follows hydrogen peroxide 23Kg, formic acid 7Kg and methanol 0.4Kg, and remaining component is water.

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PUM

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Abstract

The invention provides a circuit board roughening agent. The circuit board roughening agent comprises, by mass, 15% to 30% of hydrogen peroxide, 5% to 15% of formic acid, 0.1% to 0.8% of methanol andwater balance. The circuit board roughening agent provided by the invention has the advantages of fast roughening speed, constant copper etch rate, good bite rate, good roughening effect and convenient circuit board automation production. By using the circuit board roughening agent provided by the invention, the roughening speed of metal copper on the surface of a circuit board is constantly controlled at 0.5 to 5 micrometers / minute. The biting speed during the roughening process of metal copper on the surface of the circuit board is constant. The need of the existing circuit board automationproduction line for automatic circuit board roughening is met. The production efficiency is improved. The cost is reduced.

Description

technical field [0001] The invention belongs to the technical field of circuit board surface treatment agents, in particular to a circuit board roughening treatment agent. Background technique [0002] In the circuit production process, before the ink is printed on the circuit board, it is usually necessary to roughen the metal on the surface of the circuit board to increase the adhesion of the ink to the circuit board and improve the quality of the circuit board. When the existing circuit board is roughened, it usually uses special conductive metal surface treatment agents for circuit boards, such as roughening agents, to treat the surface of the circuit board, so that the metal surface of the circuit board can be moderately roughened. Increase the bonding area and increase the surface bonding force, thereby improving the adhesion performance of the metal surface of the circuit board. However, in the actual production process, it is found that when the existing circuit boa...

Claims

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Application Information

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IPC IPC(8): H05K3/38C23F1/18
CPCC23F1/18H05K3/383
Inventor 徐刚蔡国军苑举春李瀚罗昭斌詹梓轩邵家维周选文钟丽君
Owner 惠州市鸿宇泰科技有限公司
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