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3results about How to "Production Process Automation" patented technology

Photovoltaic module label production apparatus

ActiveCN224477159UProduction Process AutomationIncrease productivityMechanical engineeringIndustrial engineering
The application relates to a photovoltaic module label production device, which comprises a machine table with a working surface, a printing device, a material moving device, a label transfer device, a hot pressing device and a rubberizing device arranged on the machine table, and a first material placing device and a conveying device arranged on the working surface. The printing device is used for printing labels. The first material placing device is used for placing label packages. The material moving device is used for transferring materials. The conveying device is used for conveying the label packages in a first direction. The label transfer device comprises a label placing part. The label placing part is used for placing the printed labels, and the label placing part can move in a second direction. The second direction is different from the first direction. The hot pressing device and the rubberizing device are sequentially arranged in the discharging direction of the conveying device. The hot pressing device is used for hot pressing and sealing the label packages with the labels. The rubberizing device is used for rubberizing the label packages after the hot pressing and sealing.
Owner:通威太阳能(盐城)有限公司

Fermenter with on-line bacteria separation

ActiveCN224411732UContinuous productionProduction Process Automation
The utility model discloses a kind of fermentation tanks with on-line working bacteria separation, including tank body, the tank body side is provided with material guiding pump, refrigerator and centrifuge, tank body bottom is equipped with outlet, and outlet is connected with the input end of first discharge pipe and material guiding pump respectively by three-way, the output end of material guiding pump is connected with refrigerator inlet by first pipeline, refrigerator outlet is connected with centrifuge inlet by second pipeline, centrifuge outlet is connected to tank body top by third pipeline, it is connected between first pipeline and third pipeline by fourth pipeline, second discharge pipe is also connected on third pipeline, it is connected between second pipeline and fourth pipeline by fifth pipeline, third discharge pipe is also connected on second pipeline;The fermentation tank is integrated by tank body, refrigerator and centrifuge Design, then cooperate the adjustment of various valves, can realize static microorganism separation, material liquid circulation, continuous on-line separation production etc. Function, make production process continuous, automation, improve production efficiency.
Owner:黄衡

Post-surface-mounting curing device for printed circuit board

PendingCN121888494ARealize active dynamic controlGuaranteed uniformityPrinted circuit dryingThermodynamicsRadiation field
The invention provides a curing device for a printed circuit board after surface mounting, and particularly relates to the technical field of printed circuit board processing equipment.The curing device comprises a T-shaped machine body, a radiation curing unit is fixed in a curing box body, the radiation curing unit comprises an inner suspension body, a top cover, a lampshade body and a UV lamp body, and the UV lamp body is installed in the lampshade body; according to the printed circuit board surface-mounted post-curing device, the dynamic thermal field adjusting mechanism is independently arranged below each lampshade body, and the dynamic thermal field adjusting mechanisms are matched with the temperature detection parts corresponding to the dynamic thermal field adjusting mechanisms and the dynamic driving assemblies installed on the outer walls of the two sides of the bearing frame body; the electronic control linkage of the three parts is realized, and the adjusting mechanism performs the angle adjusting action according to the temperature measuring signal, so that the technical defects that the curing temperature of the PCB surface is not uniform and the dynamic adjustment is lacked from the radiation field level in the traditional curing device after the printed circuit board is mounted are solved, the active dynamic regulation and control of the PCB curing thermal field are realized, and the production efficiency is improved. The overall uniformity of a PCB curing thermal field is guaranteed, and the curing quality of the PCB after surface mounting is improved.
Owner:SHENZHEN CHUANGXIN ZHIHUI ELECTRONIC TECH CO LTD