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Electronic component testing device

A technology for electronic components and testing devices, applied in the field of electronic component testing devices, can solve problems such as unfavorable spatial arrangement of testing areas, bulky testing equipment, etc.

Active Publication Date: 2019-12-06
CHROMA ATE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the above-mentioned testing equipment is bulky, especially in the height direction, which takes up a lot of volume, which is not conducive to the spatial arrangement of the test area.

Method used

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Embodiment Construction

[0023] Before the electronic component testing device of the present invention is described in detail in this embodiment, it should be noted that in the following description, similar components will be denoted by the same component symbols. Furthermore, the drawings of the present invention are for illustration purposes only, and are not necessarily drawn to scale, and not all details may be presented in the drawings.

[0024] Please also see Figure 1 to Figure 4 , figure 1 It is a perspective view of the first embodiment of the present invention in the state of loading or unloading electronic components; figure 2 It is an exploded view of the first embodiment of the present invention; image 3 It is a perspective view of the first embodiment of the present invention in a test state; Figure 4 It is a cross-sectional view of the first embodiment of the present invention in a test state, which is image 3 The sectional view of the second direction D2 (A-A line segment) i...

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Abstract

The invention relates to an electronic component testing device. The device mainly comprises a lower base, an upper base and a pressure generation module. When an electronic component is to be tested,the electronic component is placed in a chip accommodating groove of the lower base, the lower base and the upper base slide relatively under the guidance of a first sliding guide device and a secondsliding guide device, so the pressure generation module between the lower base and the upper base is aligned to the electronic component and applies pressure to the electronic component. The device is advantaged in that the volume occupied by the device can be greatly reduced, the number or test areas of test devices is increased, so test efficiency is maximized; in addition, the acting force andthe counter-acting force can be borne, internal force balance is achieved, stability of equipment is improved, and the service life of the equipment is prolonged.

Description

technical field [0001] The invention relates to an electronic component testing device, in particular to a device suitable for crimping an electronic component on a testing jig so as to facilitate the testing of the quality of the electronic component. Background technique [0002] With the continuous evolution of semiconductor technology, the functions and computing power of a single chip are becoming more and more powerful; however, the number of contacts or pins of the chip is becoming more and more alarming. According to the current technical level, the size of some chips has been as large as 70mm×70mm, and the number of contacts on it has reached more than 4,500. [0003] However, in order to detect whether the chip is good or bad, generally pogo pins are used to contact the contacts on the chip. As the spring force of each pogo pin is about 25-35gf, 4500 pogo pins ( pogo pin) produces a spring force of about 115Kgf. Therefore, the detection device itself must apply e...

Claims

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Application Information

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IPC IPC(8): G01R31/00
CPCG01R31/00
Inventor 陈建名吕孟恭陈勇志
Owner CHROMA ATE