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Electronic component testing device

A technology for electronic components and testing devices, applied in the field of electronic component testing devices, can solve the problems of unfavorable test area space arrangement, large size of testing equipment, etc., and achieve the effects of improving reliability and service life and reducing overall volume.

Active Publication Date: 2022-03-29
CHROMA ATE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the above-mentioned testing equipment is bulky, especially in the height direction, which takes up a lot of volume, which is not conducive to the spatial arrangement of the test area.

Method used

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Embodiment Construction

[0023] Before the electronic component testing apparatus of the present invention is described in detail in this embodiment, it should be noted that, in the following description, similar components will be represented by the same reference numerals. Furthermore, the drawings of the present invention are for illustrative purposes only, they are not necessarily drawn to scale, and not all details are necessarily presented in the drawings.

[0024] see also Figure 1 to Figure 4 , figure 1 It is a perspective view of the first embodiment of the present invention in the state of loading or unloading electronic components; figure 2 It is an exploded view of the first embodiment of the present invention; image 3 It is a perspective view of the first embodiment of the present invention in a test state; Figure 4 It is a cross-sectional view of the first embodiment of the present invention in a test state, which is image 3 A cross-sectional view in the second direction D2 (A-A...

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Abstract

The invention relates to an electronic component testing device, which mainly includes a lower base, an upper base and a pressure generating module. The upper base is guided by the first sliding guide device and the second sliding guide device to form a relative slide, so that the pressure generating module located between the lower base and the upper base is located on the electronic component, and Apply pressure to electronic components. Accordingly, the present invention can greatly reduce the volume occupied by the device, increase the number of test devices or test areas, and maximize the test efficiency; in addition, it can also withstand the action force and reaction force, achieve internal force balance, and improve the stability of the equipment and service life.

Description

technical field [0001] The present invention relates to an electronic component testing device, in particular to a device suitable for crimping electronic components on a detection fixture, so as to facilitate the detection of the quality of electronic components. Background technique [0002] With the continuous evolution of semiconductor technology, the functions and computing power of a single chip are becoming more and more powerful; however, the number of contacts or pins on the chip is also more and more amazing. According to the current technical level, the size of some chips has been as large as 70mm×70mm, and the above contacts have reached more than 4500. [0003] However, in order to detect whether the chip is good or not, pogo pins are generally used to contact the contacts on the chip. Assuming that the spring force of each pogo pin is about 25-35gf, 4500 pogo pins ( pogo pin) produces a spring force of about 115Kgf. Therefore, the detection device itself must...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/00
CPCG01R31/00
Inventor 陈建名吕孟恭陈勇志
Owner CHROMA ATE