Flexible circuit board and method for manufacturing flexible circuit board

Abstract

A method for manufacturing a flexible circuit board includes: providing a double-sided copper-clad substrate; etching a first copper layer to obtain two first circuit layers; covering each first circuit layer with a first adhesive layer, a first insulating layer and a second copper layer, and etching the second copper layer to obtain two second circuit layers; covering each second circuit layer with a second adhesive layer and a second insulating layer; forming a third copper layer on the surface of each second insulating layer, and etching the third copper layers to obtain two third circuit layers; covering each third circuit layer with a third adhesive layer and a protective layer; disposing a first groove and a second groove in the protective layer and the adjacent third adhesive layer,wherein a slot is disposed at a position corresponding to the second groove from the protective layer to the second adhesive layer on the other side of the substrate, so that the second insulating layer on a side of the second groove and the corresponding third circuit layer constitute a single-sided board region at a portion corresponding to the slot.

Description

technical field [0001] The invention relates to a printed circuit board technology, in particular to a flexible circuit board and a manufacturing method of the flexible circuit board. Background technique [0002] Nowadays, more and more electronic products such as smartphones and tablet computers use active matrix organic light emitting diode (AMOLED) screens. For the high integration requirements of this type of screen, the high-density wiring of the flexible circuit board used to drive the screen will face many challenges. [0003] A conventional flexible circuit board includes inner circuits and outer circuits, and electronic chips for driving the screen are mounted on the inner circuits. In order to meet the alignment requirements of the center pitch of the electronic chip pins, the line width and line pitch of the inner layer circuits usually need to be less than 10 μm / 10 μm. However, after the inner circuit is fabricated, the size of the multi-layer circuit board wi...

AI Technical Summary

Problems solved by technology

However, after the inner circuit is fabricated, due to a series of follow-up processes, the size of the multi-layer circuit board will change greatly, so that the final electronic chip cannot be accurately aligned.

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