Flexible circuit board and manufacturing method of said flexible circuit board

Abstract

A method for manufacturing a flexible circuit board, comprising: providing a double-sided copper-clad substrate; etching the first copper layer to obtain two first circuit layers; covering each first circuit layer with a first adhesive layer, a first insulating Layer and the second copper layer, etch the second copper layer to obtain two second circuit layers; cover the second adhesive layer and the second insulating layer on each second circuit layer; in each second insulating layer A third copper layer is formed on the surface, and the third copper layer is etched to obtain two third circuit layers; a third glue layer and a protective layer are covered on each third circuit layer; A first groove and a second groove are provided in the third adhesive layer, and a groove is opened at a position corresponding to the second groove from one of the protective layers to the second adhesive layer on the other side of the base layer, thereby The second insulating layer on one side of the second groove and the corresponding third wiring layer form a single-panel area at a portion corresponding to the groove.

Description

technical field [0001] The invention relates to a printed circuit board technology, in particular to a flexible circuit board and a manufacturing method of the flexible circuit board. Background technique [0002] Nowadays, more and more electronic products such as smartphones and tablet computers use active matrix organic light emitting diode (AMOLED) screens. For the high integration requirements of this type of screen, the high-density wiring of the flexible circuit board used to drive the screen will face many challenges. [0003] A conventional flexible circuit board includes inner circuits and outer circuits, and electronic chips for driving the screen are mounted on the inner circuits. In order to meet the alignment requirements of the center pitch of the electronic chip pins, the line width and line pitch of the inner layer circuits usually need to be less than 10 μm / 10 μm. However, after the inner circuit is fabricated, the size of the multi-layer circuit board wi...

AI Technical Summary

Problems solved by technology

However, after the inner circuit is fabricated, due to a series of follow-up processes, the size of the multi-layer circuit board will change greatly, so that the final electronic chip cannot be accurately aligned.

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