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Method for controlling planarization process and chemical mechanical planarization device

A technology of process and process parameters, applied in the direction of manufacturing tools, grinding devices, grinding/polishing equipment, etc., can solve the problems of low efficiency and poor effect, and achieve the effect of improving the uniformity of polishing

Active Publication Date: 2019-12-13
HWATSING TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there are problems of poor effect and low efficiency in the process control of wafer polishing uniformity, which need to be solved urgently

Method used

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  • Method for controlling planarization process and chemical mechanical planarization device
  • Method for controlling planarization process and chemical mechanical planarization device
  • Method for controlling planarization process and chemical mechanical planarization device

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Embodiment Construction

[0021] The technical solutions of the present invention will be described in detail below with reference to specific embodiments and accompanying drawings. The embodiments described herein are specific embodiments of the present invention, used to illustrate the concept of the present invention; these descriptions are all explanatory and exemplary, and should not be construed as limiting the embodiments of the present invention and the protection scope of the present invention . In addition to the embodiments described herein, those skilled in the art can also adopt other obvious technical solutions based on the content disclosed in the claims of the present application and the description thereof, and these technical solutions include adopting any modifications made to the embodiments described herein. Obvious alternative and modified technical solutions.

[0022] In order to illustrate the technical solutions of the present invention, the following specific embodiments are ...

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Abstract

The invention provides a method for controlling a planarization process and a chemical mechanical planarization device. The device comprises a planarization disk covered with a planarization pad usedfor planarization on a wafer, a bearing head used for holding the wafer and pressing the wafer on the planarization pad, a measuring module used for obtaining measurement data of wafer planarization by using an online measuring tool, and a control module used for correcting process parameters according to the measurement data obtained before and after the process so as to improve the planarizationuniformity.

Description

technical field [0001] The invention belongs to the technical field of chemical mechanical polishing, and in particular relates to a method for controlling a polishing process and a chemical mechanical polishing device. Background technique [0002] Chemical Mechanical Planarization (CMP) is a global surface planarization technique used to reduce the effects of wafer thickness variation and surface topography during semiconductor manufacturing. Because CMP can precisely and uniformly planarize the wafer to the desired thickness and flatness, it has become one of the most widely used surface planarization techniques in semiconductor manufacturing. [0003] The realization process of the CMP process is as follows: the carrier head holds the wafer and rotates at a certain speed and reciprocates horizontally, while applying a certain down force to press the wafer on the rotating polishing pad, which is composed of sub-micron or nano-abrasive particles and chemical solutions. Th...

Claims

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Application Information

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IPC IPC(8): B24B1/00B24B37/005B24B49/04
CPCB24B1/00B24B37/005B24B49/04
Inventor 曹阳金军靳富
Owner HWATSING TECH
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