Wire shielding overlap structure

A wire shielding and main wire technology, applied in the direction of conductive connection, connection, connection insulation, etc., can solve the problems of damage, main wire and ground wire are susceptible to high temperature, etc., to avoid high temperature damage, prevent relative movement, reduce bending effect of radius

Active Publication Date: 2019-12-24
中航光电互连科技(南昌)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a wire shielding lap joint structure to solve the problem that in the prior art, the main wire shielding layer and the grounding wire core are connected by melting solder, which causes the main wire and the grounding wire to be easily damaged by high temperature.

Method used

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Examples

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Embodiment Construction

[0023] The embodiments of the present invention will be further described below in conjunction with the drawings.

[0024] Specific embodiment 1 of the wire shielding overlap structure of the present invention, such as Figure 2 to Figure 3 As shown, the wire shielding overlap structure includes a main wire and a ground wire. The main wire includes a main wire outer sheath from the outside to the inside, a main wire shielding layer, a main wire insulation layer 42 and a main wire core. The ground wire includes a main wire core from the outside to the inside. The ground wire insulation layer and the ground wire core.

[0025] In order to realize the grounding of the main conductor, the core of the ground conductor must be electrically connected to the main conductor shielding layer. In this embodiment, a lap section is provided at the corresponding end of the main wire and the ground wire. The exposed part of the main wire shielding layer at the lap section of the main wire forms t...

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PUM

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Abstract

The invention provides a wire shielding overlap structure which comprises a main wire and a ground wire. The main wire and the ground wire are provided with corresponding overlap sections. The overlapsection of the main wire comprises an exposed main wire shield layer part. The overlap section of the ground wire comprises an exposed ground wire core part. The main wire shield layer part is conductively overlapped with the ground wire core part. The wire shielding overlap structure further comprises a coil spring or a wire spring or a spiral wire clamp which sleeves the main wire shield layerpart and the ground wire core part and is retracted radially to clamp the two parts, and an insulation structure which wraps the overlap sections of the main wire and the ground wire. The coil springor the wire spring or the spiral wire clamp is radially retracted to clamp the main wire shield layer part and the ground wire core part. In addition, the coil spring or the wire spring or the spiralwire clamp has a certain degree of flexibility, and can be bent with the main wire during wiring.

Description

Technical field [0001] The invention relates to a wire shielding overlap structure. Background technique [0002] Shield grounding is required at the end of the traditional cable connection. Usually, the outer sheath of the cable (wire) is stripped to expose the shielding layer of the wire, and then the core of the grounding wire is connected to the shielding layer of the wire. Conductive and fixed connection to ground the wire. [0003] The grounding method of the wire in the prior art is as attached figure 1 As shown, the main conductor 100 includes a main conductor outer sheath 13, a main conductor shielding layer 12, a main conductor insulation layer 11, and a main conductor core (attached figure 1 Not shown in ), in order to shield and ground the main conductor 100, a ground wire 21 is additionally arranged, and the ground wire 21 has a ground wire core 22. A section of the main wire 100 close to one end of the main wire 100 is the overlap section of the main wire 100, and a ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R4/48H01R4/10H01R4/02H01R4/70
CPCH01R4/021H01R4/10H01R4/4863H01R4/70
Inventor 娄晓刚陈德杰
Owner 中航光电互连科技(南昌)有限公司
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