Circulating hot tube type radiator

Abstract

This invention relates to a heat pipe radiator of a circulation structure applying the thermal siphon theory, which can apply high efficient and cheap expand tube technology to solve the problem of contact heat resistance by introducing an intensified cross-vetilation heat-transmission structure to optimize the design of fins, which not only reduces cost for raw materials and manufacture but also increases heat radiation volume.

Description

Technical field [0001] The invention relates to the technical field of heat dissipation of electronic devices, in particular to the heat dissipation of semiconductor integrated circuit devices and semiconductor power devices. Background technique [0002] As the number of transistors in semiconductor integrated circuits increases and the power of semiconductor power devices increases, the heat generated by the devices also increases. At present, the problem of heat generation and heat dissipation of the computer chip CPU has become an obstacle in the development of computers. The radiator with a simple fin and fan structure can no longer meet the requirements. At present, heat pipe radiators are generally used. [0003] The basic structure of the heat pipe currently used in the CPU radiator is: both ends are sealed, and there is a copper tube with a capillary structure inside. Since the CPUs in desktop computers are all placed vertically, the heat pipes in the heat pipe rad...

AI Technical Summary

Problems solved by technology

[0004] At present, the porous structure sintered in the copper tube is generally used to realize the siphon. Due to the technical requirements, the heat pipe must be vacuumized, filled with working fluid, and sealed and welded before the subsequent process can be carried out. Therefore, the sleeve process of expanding the heat exchange fins is set. The existing high-efficiency tube expansion process cannot be used to ensure effective contact between the fins and the heat pipe, that is, to solve the problem of contact thermal resistance

Using soldering, the production efficiency is not high, and the high temperature during welding may cause the danger of explosion of the heat pipe

One by one, the problems are: high precision requirements for the outer diameter of the heat pipe, unreliable contact, and low production efficiency

The capillary structure in the heat pipe cannot be damaged, and the minimum bending radius of the heat pipe is limited, so the size of the heat sink is not easy to achieve a compact design

In addition, the production process of the current heat pipe itself is very complicated and the requirements are very high. Oxygen-free copper pipes are sintered in reducing gas (hydrogen) at high temperature (thousands of degrees) for many times, and there is a problem of sintering yield, so the cost of the heat pipe itself is very high.

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