Thermal insulation device
A heat insulation device and heat pipe technology, applied in building components, heat preservation, etc., can solve problems such as troublesome maintenance and replacement, failure of electric heating methods, damage to plastic sheaths, etc.
Pending Publication Date: 2019-12-27
CHONGQING ATEC TEST EQUIP
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Problems solved by technology
However, the cables used in the electric heating method have been in harsh environments for a long time, and the plastic sheath is easily damaged due to moisture, high temperature, low temperature and other reasons, which eventually leads to the failure of the electric heating method, and once these electric heating devices are damaged, Maintenance and replacement are very troublesome
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[0021] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.
[0022] Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art wi...
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The invention provides a thermal insulation device, and relates to the technical field of thermal insulation. The thermal insulation device comprises an airtight chamber and a heat conduction pipe, wherein the airtight chamber is arranged between a first temperature environment and a second temperature environment; the temperature of the first temperature environment is lower than that of the second temperature environment; the heat conduction pipe is used for transferring heat to the airtight chamber; a third temperature substance is fed into the heat conduction pipe; and the temperature of the third temperature substance is higher than the temperature of the second temperature environment. The thermal insulation device can avoid condensation on the surface of equipment with a low temperature environment inside; the mode of heating is relatively stable; and the structure of the device is relatively simple.
Description
technical field [0001] The invention relates to the technical field of heat insulation, in particular to a heat insulation device. Background technique [0002] Condensation is a phenomenon in which a high-temperature and high-humidity gas liquefies into a liquid on the surface of a low-temperature object when it reaches the dew point temperature when it encounters a low-temperature object. Since the temperature inside the box is much lower than the temperature outside the box when the equipment such as the three-in-one test box, refrigerator, and freezer is running, the sides of the box door, the door seal and other heat insulation parts are directly affected by the cold air inside the box. The role of the surface is prone to condensation. [0003] At present, in order to prevent condensation on the surface of these devices, heating devices are generally attached to the inner surfaces of these heat insulation components, and the surface temperature is increased by means of...
Claims
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IPC IPC(8): E04B1/76E04B1/80
CPCE04B1/76E04B1/80
Inventor 张杰彭福君
Owner CHONGQING ATEC TEST EQUIP