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A laser precision machining method for dense holes

A technology of precision machining and laser processing head, which is applied in the direction of metal processing equipment, laser welding equipment, manufacturing tools, etc. It can solve the problems that it is difficult to apply to large-area and high-density group hole processing, low processing efficiency, and low hole quality. The effect of less surface burrs, high processing efficiency and high finish

Active Publication Date: 2021-12-21
安徽中科春谷激光产业技术研究院有限公司
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Problems solved by technology

[0007] Purpose of the invention: The purpose of the present invention is to solve the problems existing in the laser drilling process of the above-mentioned prior art that it is difficult to apply to large-area and high-density group hole processing, and the processing efficiency is low and the hole quality is not high. Processing method, high-quality group holes can be punched on flat and complex curved surfaces, with strong versatility, short processing time and high drilling efficiency

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  • A laser precision machining method for dense holes
  • A laser precision machining method for dense holes
  • A laser precision machining method for dense holes

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Embodiment Construction

[0033] The present invention will be further explained below in conjunction with the accompanying drawings.

[0034] A laser precision processing method for dense holes of the present invention, the processing method comprises: driving the laser processing head to move to the position of the hole to be processed in the substrate through a long-stroke movement mechanism, and driving the laser processing head to the position of the hole to be processed in the substrate through a micro-motion mechanism Perform laser drilling.

[0035] like figure 1 As shown, the laser drilling includes the following steps:

[0036] Step 1, positioning the center of the hole, including: using a continuous laser beam to irradiate the substrate to form a perforation point, and using the perforation point as the hole center of the hole to be processed;

[0037] Step 2, forming the hole boundary, including: using the laser beam to surround the center of the hole and scanning according to the hole pa...

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Abstract

The invention discloses a laser precision machining method for dense holes, which includes: driving the laser processing head to move to the position of the hole to be processed in the base material through a long-stroke movement mechanism, and driving the laser processing head to perform laser processing at the position of the hole to be processed in the base material through a micro-motion mechanism. Drilling, laser drilling includes the following steps: positioning the center of the hole; forming the boundary of the hole; forming the hole; removing material in the hole. The invention solves the problems existing in the existing laser drilling process that it is difficult to apply to large-area and high-density group hole processing, and the processing efficiency is low and the hole quality is not high. A group of holes, strong versatility, short processing time and high drilling efficiency.

Description

technical field [0001] The invention belongs to the technical field of laser processing, and in particular relates to a laser precision machining method for dense holes, which uses lasers to process dense holes (micro-cluster holes) on single-plane, multi-plane or curved-surface materials, which can be applied to aerospace, military, and chemical industries , medical, environmental protection and other industries. Background technique [0002] At present, laser drilling has been widely used in the processing technology of key parts of high-end products such as aerospace, medical equipment, and hardware parts. Laser drilling refers to the laser processing process in which the laser is used as a high-intensity heat source to heat the material after being focused, so that the material in the laser action area is melted or gasified and then evaporated to form holes. The laser beam is highly concentrated in space and time by lens focusing, and the laser spot diameter can be redu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/382B23K26/70
CPCB23K26/382B23K26/702
Inventor 朱丽于一强梁小龙高超
Owner 安徽中科春谷激光产业技术研究院有限公司
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