Electronic equipment component heating control system and method

A technology for control systems and electronic equipment, applied in electrical components, ohmic resistance heating, electric heating devices, etc., can solve the problems of low temperature adaptability of electronic equipment components, small heating power requirements, etc., to solve the low temperature adaptability problem, heating power Small demand and energy saving effect

Inactive Publication Date: 2020-01-03
江西航天海虹测控技术有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a heating control system and control method for electronic equipment components, which has small heating power requirements and fast heating, and solves electronic equipment components without increasing the cost of electronic equipment and solving problems such as circuit interference caused by traditional methods. low temperature adaptability

Method used

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  • Electronic equipment component heating control system and method

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Experimental program
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Effect test

Embodiment 1

[0029] A heating control system for electronic equipment components, the system includes a circuit board 1, and an electric heating plate 2 equipped with a heater 6, two electric heating plates 2 are provided, and are distributed in parallel on the Both sides of circuit board 1.

[0030] Wherein, the bottom of the circuit board 1 is provided with a sensor 4, and the sensor 4 is connected with a controller 5, the controller 5 is connected with the electric heating plate 2, and the controller 5 is connected with a DC power supply module 3, and the DC power supply module 3 is connected with the electric heating plate 2. The heater 6 is connected, and then the DC power supply module 3 can supply power to the controller 5 and the heater 6 .

[0031] Furthermore, the heating power requirement is small and the heating is fast, and the problem of low temperature adaptability of electronic equipment components is solved without increasing the cost of electronic equipment to solve probl...

Embodiment 2

[0033] An embodiment of the present invention provides a heating control system for electronic equipment components, which is further defined on the basis of Embodiment 1.

[0034] Such as figure 1 As shown, the circuit board 1 and the sensor 4 are pasted and fixed.

[0035] The heater 6 is a thin film heater, and is pasted on the electric heating plate 2 .

[0036] Further, the heater 6 is pasted on the electric heating plate 2 through silicon rubber.

[0037] Optimally, the silicone rubber is GD414 silicone rubber.

[0038] Further, the thickness of the heater 6 is no more than 2mm.

Embodiment 3

[0040] The embodiment of the present invention is further limited on the basis of embodiment 1 and embodiment 2.

[0041] A control method for a heating control system of electronic equipment components, comprising the following steps:

[0042] Utilize the sensor 4 to collect the temperature of the circuit board 1 in real time, and feed back the collected temperature to the controller 5. The controller 5 compares the collected temperature with the set heating threshold temperature. If it does not exceed the heating threshold temperature, control The heater 6 starts heating work, and the temperature of the working environment of the circuit board 1 rises. At the same time, the controller 5 will compare the temperature of the real-time collected circuit board 1 with the set threshold temperature for stopping heating. , then the heater 6 is controlled to stop heating.

[0043] Furthermore, when the temperature is higher than a certain temperature, the heating is stopped, and the...

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Abstract

The invention relates to the technical field of electronic product environment temperature adaptability and particularly relates to an electronic equipment component heating control system. The systemcomprises a circuit board and two electric heating plates provided with heaters, wherein the two electric heating plates are distributed on two sides of the circuit board in parallel, the bottom of the circuit board is provided with a sensor, the sensor is connected with a controller, the controller is connected with the electric heating plates, the controller is connected with a direct-current power supply module, and the direct-current power supply module is connected with a heater so that the direct-current power supply module can supply power to the controller and the heater. The system is advantaged in that the heating power requirement is small, heating is fast, and a problem of low-temperature adaptability of components of the electronic equipment is solved under the condition thatthe cost of the electronic equipment is not increased and problems of circuit interference and the like caused by a traditional method are solved.

Description

technical field [0001] The invention relates to the technical field of environmental temperature adaptability of electronic products, in particular to a heating control system and control method for components of electronic equipment. Background technique [0002] With the further development of sea, land and air fields involved in electronic equipment carrying platforms, higher requirements are put forward for the environmental temperature adaptability of electronic equipment components, especially the low temperature adaptability requirements. Some platforms have proposed The requirements for normal operation in a low-temperature environment of -55°C are even lower, and most industrial-grade components cannot meet this requirement; In addition to components, the method of actively heating and compensating components can also be used; and there are two traditional temperature compensation methods: [0003] The first one is to heat the shell of the electronic equipment. A f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05B3/20H05B1/02
CPCH05B1/0227H05B3/20
Inventor 姚先秀李科连马文超邹利伟徐森王小江吴斌周向华徐全堂章文静黎超杨海
Owner 江西航天海虹测控技术有限责任公司
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